In a semiconductor device that needs a refresh operation for storing data, data of memory cells selected in response to a row address is read to main amplifiers through bit line pairs, sense amplifiers and data line pairs in a page-mode read operation. Thereafter, while outputting the data held in the main amplifiers to the outside, connecting transistors are turned off so as to disconnect the main amplifiers from the memory cells, and thus, the memory cells can be precharged. Also, in a page-mode write operation, while writing externally supplied input data in the main amplifiers, the memory cells can be precharged.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device comprising: a plurality of memory cells; a plurality of bit line pairs respectively connected to said plurality of memory cells through transistors; a plurality of sense amplifiers respectively connected to said plurality of bit line pairs; a plurality of data line pairs respectively connected to said plurality of sense amplifiers; a plurality of main amplifiers respectively connected to said plurality of data line pairs; a plurality of switching circuits respectively provided between said plurality of sense amplifiers and said plurality of main amplifiers each for connecting/disconnecting a corresponding sense amplifier to/from a corresponding main amplifier; and a memory control circuit, wherein said memory control circuit controls said plurality of sense amplifiers, said plurality of main amplifiers and said plurality of switching circuits in such a manner as to: receive a reading row control signal, a write enable signal, a clock signal, a row address and a column address; data read from memory cells selected in response to said row address into corresponding main amplifiers through said bit line pairs, said sense amplifiers and said data line pairs in accordance with said clock signal when said reading row control signal is at active level; disconnect said plurality of sense amplifiers from said plurality of main amplifiers by opening said plurality of switching circuits after said data read from said memory cells into said main amplifiers, and precharge said plurality of bit line pairs with said data held in said plurality of main amplifiers; and output data held in said main amplifiers selected in response to said column address in accordance with said clock signal when said write enable signal is at non-active level.
2. A semiconductor device comprising: a plurality of memory cells; a plurality of bit line pairs respectively connected to said plurality of memory cells through transistors; a plurality of sense amplifiers respectively connected to said plurality of bit line pairs; a plurality of data line pairs respectively connected to said plurality of sense amplifiers; a plurality of main amplifiers respectively connected to said plurality of data line pairs; a plurality of switching circuits respectively provided between said plurality of sense amplifiers and said plurality of main amplifiers each for connecting/disconnecting a corresponding sense amplifier to/from a corresponding main amplifier; and a memory control circuit, wherein said memory control circuit performs processing of: receiving a reading row control signal, a writing row control signal, a write enable signal, a clock signal, a row address and a column address; data read from memory cells selected in response to said row address into corresponding main amplifiers through said bit line pairs, said sense amplifiers and said data line pairs in accordance with said clock signal when said reading row control signal is at active level; when said write enable signal is at active level, externally supplied input data into main amplifiers selected in response to said column address, disconnecting said plurality of sense amplifiers from said plurality of main amplifiers by opening said plurality of switching circuits, and precharging said plurality of bit line pairs with said sense amplifiers disconnected from said main amplifiers; and writing data held in said main amplifiers into memory cells selected in response to said row address through said sense amplifiers in accordance with said clock signal when said writing row control signal is at active level.
3. A semiconductor device comprising: a plurality of memory cells; a plurality of bit line pairs respectively connected to said plurality of memory cells through transistors; a plurality of sense amplifiers respectively connected to said plurality of bit line pairs; a plurality of data line pairs respectively connected to said plurality of sense amplifiers; a plurality of main amplifiers respectively connected to said plurality of data line pairs; a plurality of switching circuits respectively provided between said plurality of sense amplifiers and said plurality of main amplifiers each for connecting/disconnecting a corresponding sense amplifier to/from a corresponding main amplifier; and a memory control circuit, wherein said memory control circuit controls said plurality of sense amplifiers, said plurality of main amplifiers and said plurality of switching circuits in such a manner as to: receive a reading row control signal, a write enable signal, a writing row control signal, a clock signal, a row address and a column address; data read from memory cells selected in response to said row address into corresponding main amplifiers through said bit line pairs, said sense amplifiers and said data line pairs in accordance with said clock signal when said reading row control signal is at active level; disconnect said plurality of sense amplifiers from said plurality of main amplifiers by opening said plurality of switching circuits after said data read from said memory cells into said main amplifiers, and precharge said plurality of bit line pairs with said data held in said plurality of main amplifiers; output data held in said main amplifiers selected in response to said column address in accordance with said clock signal when said write enable signal is at non-active level; when said write enable signal is at active level, externally supplied input data into main amplifiers selected in response to said column address, disconnect said plurality of sense amplifiers from said plurality of main amplifiers by opening said plurality of switching circuits, and precharge said plurality of bit line pairs with said sense amplifiers disconnected from said main amplifiers; and write data held in said main amplifiers into memory cells selected in response to said row address through said plurality of sense amplifiers in accordance with said clock signal when said writing row control signal is at active level.
4. The semiconductor device of claim 1 or 3 , wherein said memory control circuit receives a column control signal, and outputs, when said write enable signal is at non-active level, data held in main amplifiers selected in response to said column address in accordance with said clock signal when said column control signal is at active level.
5. The semiconductor device of claim 2 or 3 , wherein said plurality of switching circuits are composed of connecting transistors disposed between said plurality of data line pairs and said plurality of main amplifiers, and said memory control circuit controls said connecting transistors to be turned on for writing data held in said main amplifiers into said memory cells through said sense amplifiers in accordance with said clock signal when said writing row control signal is at active level, and controls said connecting transistors to be turned off in a time other than a time for writing said data.
6. The semiconductor device of claim 2 or 3 , wherein, when said write enable signal is activated subsequently after said reading row control signal is activated, said memory control circuit writes said externally supplied input data into said main amplifiers after writing said data read from said memory cells into said main amplifiers.
7. The semiconductor device of claim 2 or 3 , wherein said memory control circuit receives a column control signal, and writes, when said write enable signal is at active level, said externally supplied input data into said main amplifiers selected in response to said column address as far as said column control signal is at active level.
8. The semiconductor device of claim 2 or 3 , wherein said memory control circuit writes said data held in said main amplifiers into said memory cells through said sense amplifiers with amplifying operations of said sense amplifiers halted when said writing row control signal is at active level.
9. The semiconductor device of claim 2 or 3 , wherein said memory control circuit receives a column control signal, and writes, when said writing row control signal is at active level, said data held in said main amplifiers into said memory cells through said sense amplifiers when said column control signal is at active level.
10. The semiconductor device of claim 1 , 2 or 3 , wherein, in a clock cycle following activation of said reading row control signal, said memory control circuit writes data read from said memory cells into said main amplifiers through said data line pairs after precharging said data line pairs.
11. The semiconductor device of claim 1 , 2 or 3 , wherein said memory control circuit receives a column control signal, and writes data read from said memory cells selected in response to said row address into said main amplifies through said sense amplifiers when said column control signal is activated after activation of said reading row control signal.
12. The semiconductor device of claim 1 , 2 or 3 , wherein said switching circuits are composed of connecting transistors disposed between said data line pairs and said main amplifiers, and said memory control circuit controls said connecting transistors to be turned on at start of writing said data read from said memory cells into said main amplifiers when said reading row control signal is at active level, and controls said connecting transistors to be turned off when an amplitude difference between each data line pair attains a level that is able to be sense amplified by a corresponding main amplifier.
13. The semiconductor device of claim 1 , 2 or 3 , wherein said memory control circuit receives a refresh control signal, and starts a refresh operation for said memory cells in accordance with said clock signal when said refresh control signal is at active level and completes said refresh operation within one clock signal cycle.
14. A semiconductor device comprising: a plurality of memory cells; a plurality of bit line pairs respectively connected to said plurality of memory cells through transistors; a plurality of sense amplifiers respectively connected to said plurality of bit line pairs; a plurality of data line pairs respectively connected to said plurality of sense amplifiers; a plurality of main amplifiers respectively connected to said plurality of data line pairs; a plurality of switching circuits respectively provided between said plurality of sense amplifiers and said plurality of main amplifiers each for connecting/disconnecting a corresponding sense amplifier to/from a corresponding main amplifier; and a memory control circuit, wherein said memory control circuit performs processing of: receiving a writing row control signal, a write enable signal, a clock signal, a row address and a column address; when said write enable signal is at active level, externally supplied input data into main amplifiers selected in response to said column address, disconnecting said plurality of sense amplifiers from said plurality of main amplifiers by opening said plurality of switching circuits, and precharging said plurality of bit line pairs with said data held in said plurality of main amplifiers; and writing data held in said main amplifiers into memory cells selected in response to said row address through said sense amplifiers in accordance with said clock signal when said writing row control signal is at active level.
15. A semiconductor device comprising: a plurality of memory cells; a plurality of bit line pairs respectively connected to said plurality of memory cells through transistors; a plurality of sense amplifiers respectively connected to said plurality of bit line pairs; a plurality of data line pairs respectively connected to said plurality of sense amplifiers; a plurality of main amplifiers respectively connected to said plurality of data line pairs; a plurality of switching circuits respectively provided between said plurality of sense amplifiers and said plurality of main amplifiers each for connecting/disconnecting a corresponding sense amplifier to/from a corresponding main amplifier; and a memory control circuit, wherein said memory control circuit performs processing of: receiving a reading row control signal, a writing row control signal, a write enable signal, a clock signal, a row address and a column address; data read from memory cells selected in response to said row address into corresponding main amplifiers through said bit line pairs, said sense amplifiers and said data line pairs in accordance with said clock signal when said reading row control signal is at active level; disconnecting said plurality of sense amplifiers from said plurality of main amplifiers by opening said plurality of switching circuits after said data read from said memory cells into said main amplifiers, and precharging said plurality of bit line pairs each to identical potential with said data held in said plurality of main amplifiers; and writing data held in said main amplifiers in memory cells selected in response to said row address through said sense amplifiers in accordance with said clock signal when said writing row control signal is at active level.
16. The semiconductor device of claim 1 , 2 , 3 , 14 or 15 , further comprising: a first row address latch for receiving said row address and said clock signal and latching said row address in accordance with said clock signal; a second row address latch for latching an output of said first row address latch at timing delayed from said clock signal by a given time; and a row control circuit, wherein said row control circuit receives said clock signal and a row control signal, and outputs a row activation signal with a delay of a given time from a latch signal of said second row address latch when said row control signal is at active level at a rise or fall of said clock signal.
17. The semiconductor device of claim 16 , wherein said row control circuit receives a refresh control signal and outputs said row activation signal with a delay of a given time from a rise or fall of said clock signal when said refresh control signal is at active level at a rise or fall of said clock signal, and said given time for the delay is set to a time exceeding a delay time from said latch signal of said second row address latch to output of said row activation signal.
18. The semiconductor device of claim 2 or 3 , wherein said memory control circuit writes said externally supplied input data directly into memory cells selected in response to said row address and said column address when said reading row control signal and said writing row control signal are both at active level at a rise or fall of said clock signal.
19. The semiconductor device of claim 18 , wherein said memory control circuit halts amplifying operations of said main amplifiers when said externally supplied input data is directly written in said memory cells.
20. The semiconductor device of claim 2 or 3 , wherein said memory control circuit writes said data held in said main amplifiers through said bit line pairs immediately after a rise or fall of said clock signal when said writing row control signal is at active level at a rise or fall of said clock signal.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
August 16, 2004
November 14, 2006
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