A grey tone display and a driving method are described. The display comprises a light influencing layer, an electrode pad located adjacent to the layer at one side of the layer in order to define a pixel in the layer, an n-channel field effect transistors connected to the electrode pad at its source terminal, a p-channel field effect transistors connected to the electrode pad at its source terminal, a first control line connected to the drain terminal of the n-channel field effect transistor, a second control line connected to the drain terminal of the p-channel field effect transistor, a third control line connected to the gate terminals of the n-channel field effect transistor and the p-channel field effect transistor, and a control circuit for supplying control signals to the first, second and third control lines. By this configuration, the voltage of the electrode pad can be arbitrarily controlled by adjusting the input level at the gate terminals.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An active matrix liquid crystal display device comprising: a glass substrate; an underlying insulating film formed on said glass substrate; a pixel circuit and a driving circuit formed on said underlying insulating film; at least one thin film transistor formed in said pixel circuit, said thin film transistor having a semiconductor layer comprising source drain and channel regions; an insulating film comprising an inorganic material formed on said thin film transistor; an organic resin film over said insulating film; and a pixel electrode formed over said organic resin film and connected to said thin film transistor through an opening provided in said organic resin film, wherein said semiconductor layer exhibits a peak of Raman spectra, displaced from a peak of single crystalline silicon to the lower frequency direction, wherein said underlying insulating film contains halogen.
2. A device according to claim 1 wherein said pixel electrode is a transparent conductive film.
3. A device according to claim 1 wherein said inorganic material comprises silicon oxide.
4. A device according to claim 1 wherein said channel region comprises a material selected from the group consisting of silicon, germanium and a combination thereof.
5. A device according to claim 1 wherein said insulating film is 0.2 to 0.6 μm thick.
6. A device according to claim 1 consisting of 640×480 pixels arranged in a matrix form.
7. A device according to claim 1 consisting of 1260×960 pixels arranged in a matrix form.
8. A device according to claim 1 further comprising a conductive film formed on said insulating film and electrically connected to said thin film transistor through a contact hole formed in said insulating film.
9. A device according to claim 8 wherein said pixel electrode is connected to said thin film transistor via said conductive film.
10. A device according to claim 1 , wherein said organic resin film comprises polyimide.
11. A device according to claim 1 , wherein said channel region comprises boron at concentration in a range of 1×10 15 –1×10 18 cm −3 .
12. A semiconductor device according to claim 1 , wherein said semiconductor layer has an electron mobility of 15 to 300 cm 2 /Vsec.
13. A semiconductor device according to claim 1 , wherein said semiconductor layer has a hole mobility of 10 to 200 cm 2 /Vsec.
14. A semiconductor device according to claim 1 , wherein said underlying insulating film prevents alkali metal atoms from getting into said semiconductor layer from said glass substrate.
15. An active matrix liquid crystal display device comprising: a glass substrate; an underlying insulating film formed on said glass substrate; a pixel circuit and a driving circuit formed on said underlying insulating film; at least one thin film transistor formed in said pixel circuit, said thin film transistor having a semiconductor layer comprising source, drain and channel regions; an insulating film comprising an inorganic material formed on said thin film transistor; an organic resin film provided over said insulating film; and a pixel electrode formed over said organic resin film and connected to said thin film transistor through an opening provided in said organic resin film, wherein said semiconductor layer exhibits a peak of Raman spectra, displaced from 522 cm −1 to the lower frequency direction, and wherein said underlying insulating film contains halogen.
16. A device according to claim 15 wherein said pixel electrode is a transparent conductive film.
17. A device according to claim 15 wherein said inorganic material comprises silicon oxide.
18. A device according to claim 15 wherein said channel region comprises a material selected from the group consisting of silicon, germanium and a combination thereof.
19. A device according to claim 15 wherein said insulating film is 0.2 to 0.6 μm thick.
20. A device according to claim 15 consisting of 640×480 pixels arranged in a matrix form.
21. A device according to claim 15 consisting of 1260×960 pixels arranged in a matrix form.
22. A device according to claim 15 further comprising a conductive film on said insulating film and electrically connected to said thin film transistor through a contact hole formed in said insulating film.
23. A device according to claim 22 wherein said pixel electrode is connected to said thin film transistor via said conductive film.
24. A device according to claim 15 , wherein said organic resin film comprises polyimide.
25. A device according to claim 15 , wherein said channel region comprises boron at concentration in a range of 1×10 15 –1×10 18 cm −3 .
26. A semiconductor device according to claim 15 , wherein said semiconductor layer has an electron mobility of 15 to 300 cm 2 /Vsec.
27. A semiconductor device according to claim 15 , wherein said semiconductor layer has a hole mobility of 10 to 200 cm 2 /Vsec.
28. A semiconductor device according to claim 15 , wherein said underlying insulating film prevents alkali metal atoms from getting into said semiconductor layer from said glass substrate.
29. An active matrix liquid crystal display comprising: a glass substrate; an underlying insulating film formed on said glass substrate; a pixel circuit and a driving circuit formed on said underlying insulating film; at least one thin film transistor formed in said pixel circuit, said thin film transistor comprising: a semiconductor layer having source, drain and channel regions; a gate insulating layer adjacent to said channel region; and a gate electrode adjacent to said channel region; an insulating film comprising an inorganic material formed on said thin film transistor; and an organic resin film provided over said insulating film; wherein said semiconductor layer exhibits a peak of Raman spectra, displaced from a peak of single crystalline silicon to the lower frequency direction, wherein said underlying insulating film contains halogen.
30. A device according to claim 29 further comprising a pixel electrode formed over said organic resin film and connected to said thin film transistor through an opening provided in said organic resin film.
31. A device according to claim 30 wherein said pixel electrode is a transparent conductive film.
32. A device according to claim 29 wherein said inorganic material comprises silicon oxide.
33. A device according to claim 29 wherein said channel region comprises a material selected from the group consisting of silicon, germanium and a combination thereof.
34. A device according to claim 29 wherein said gate insulating film is 500Å to 2000Å thick.
35. A device according to claim 29 wherein said insulating film is 0.2 to 0.6 μm thick
36. A device according to claim 29 consisting of 640×480 pixels arranged in a matrix form.
37. A device according to claim 29 consisting of 1260×960 pixels arranged in a matrix form.
38. A device according to claim 29 wherein said semiconductor layer has an electron mobility of 15 to 300 cm 2 /Vsec.
39. A device according to claim 29 wherein said semiconductor layer has a hole mobility of 10 to 200 cm 2 /Vsec.
40. A device according to claim 29 further comprising a conductive film formed on said insulating film and electrically connected to said thin film transistor through a contact hole formed in said insulating film.
41. A device according to claim 40 wherein said pixel electrode is connected to said thin film transistor via said conductive film.
42. A device according to claim 29 , wherein said organic resin film comprises polyimide.
43. A device according to claim 29 , wherein said channel region comprises boron at concentration in a range of 1×10 1 –1×10 18 cm −3 .
44. A semiconductor device according to claim 29 , wherein said underlying insulating film prevents alkali metal atoms from getting into said semiconductor layer from said glass substrate.
45. An active matrix liquid crystal display device comprising: a glass substrate; an underlying insulating film formed on said glass substrate; a pixel circuit and a driving circuit formed on said underlying insulating film; at least one thin film transistor formed in said pixel circuit, said thin film transistor comprising: a semiconductor layer having source, drain and channel regions; a gate insulating layer adjacent to said channel region; an insulating film comprising an inorganic material formed on said thin film transistor; and an organic resin film provided over said thin film transistor and said insulating film; wherein said semiconductor layer comprises silicon and exhibits a peak of Raman spectra, displaced from 522 cm −1 to the lower frequency direction, and wherein said underlying insulating film contains halogen.
46. A device according to claim 45 further comprising a pixel electrode formed over said organic resin film and connected to said thin film transistor through an opening provided in said organic resin film.
47. A device according to claim 46 wherein said pixel electrode is a transparent conductive film.
48. A device according to claim 45 wherein said material comprises silicon oxide.
49. A device according to claim 45 wherein said channel region comprises a material selected from the group consisting of silicon, germanium and a combination thereof.
50. A device according to claim 45 wherein said gate insulating film is 500Å to 2000Å thick.
51. A device according to claim 45 wherein said insulating film is 0.2 to 0.6 μm thick.
52. A device according to claim 45 consisting of 640×480 pixels arranged in a matrix form.
53. A device according to claim 45 consisting of 1260×960 pixels arranged in a matrix form.
54. A device according to claim 45 wherein said semiconductor layer has an electron mobility of 15 to 300 cm 2 /Vsec.
55. A device according to claim 45 wherein said semiconductor layer has a hole mobility of 10 to 200 cm 2 /Vse.
56. A device according to claim 45 further comprising a conductive film formed on said insulating film and electrically connected to said thin film transistor through a contact hole formed in said insulating film.
57. A device according to claim 56 wherein said pixel electrode is connected to said thin film transistor via said conductive film.
58. A device according to claim 45 , wherein said organic resin film comprises polyimide.
59. A device according to claim 45 , wherein said channel region comprises boron at concentration in a range of 1×10 15 –1×10 18 cm −3 .
60. A semiconductor device according to claim 45 , wherein said underlying insulating film prevents alkali metal atoms from getting into said semiconductor layer from said glass substrate.
61. An active matrix liquid crystal display device comprising: a glass substrate; an underlying insulating film formed on said glass substrate; at least an n-channel thin film transistor and at least a p-channel thin film transistor both formed on said underlying insulating film, each of said n-channel and p-channel thin film transistors comprising: a semiconductor layer having source, drain and channel regions; a gate insulating layer adjacent to said channel region; and a gate electrode adjacent to said channel region; an insulating film comprising an inorganic material formed over said gate electrode; and an organic resin film provided over said insulating film; wherein said semiconductor layer exhibits a peak of Raman spectra, displaced from a peak of single crystalline silicon to the lower frequency direction, and wherein said underlying insulating film contains halogen.
62. A device according to claim 61 further comprising a pixel electrode formed over said organic resin film and connected to said thin film transistor through an opening provided in said organic resin film.
63. A device according to claim 62 wherein said pixel electrode is a transparent conductive film.
64. A device according to claim 61 wherein said inorganic material comprises silicon oxide.
65. A device according to claim 61 wherein said channel region comprises a material selected from the group consisting of silicon, germanium and a combination thereof.
66. A device according to claim 61 wherein said gate insulating film is 500Å to 2000Å thick.
67. A device according to claim 61 wherein said insulating film is 0.2 to 0.6 μm thick.
68. A device according to claim 61 consisting of 640×480 pixels arranged in a matrix form.
69. A device according to claim 61 consisting of 1260×960 pixels arranged in a matrix form.
70. A device according to claim 61 wherein said semiconductor layer has an electron mobility of 15 to 300 cm 2 /Vsec.
71. A device according to claim 61 wherein said semiconductor layer has a role mobility of 10 to 200 cm 2 /Vsec.
72. A device according to claim 61 further comprising a conductive film formed on said insulating film and electrically connected to said thin film transistor through a contact hole formed in said insulating film.
73. A device according to claim 72 wherein said pixel electrode is connected to said thin film transistor via said conductive film.
74. A device according to claim 61 , wherein said organic resin film comprises polyimide.
75. A device according to claim 61 , wherein said channel region of each of the n-channel and p-channel thin film transistors comprises boron at concentration in a range of 1×10 15 –1×10 18 cm −3 .
76. A semiconductor device according to claim 61 , wherein said underlying insulating film prevents alkali metal atoms from getting into said semiconductor layer from said glass substrate.
77. An active matrix liquid crystal display device comprising: a glass substrate; an underlying insulating film formed on said glass substrate; a pixel circuit and a driving circuit formed on said underlying insulating film; at least one thin film transistor formed in said pixel circuit, said thin film transistor comprising: a semiconductor layer having source, drain and channel regions; an insulating film comprising an inorganic material formed on said thin film transistor; an organic resin film provided over said insulating film; and a pixel electrode provided over said organic resin film and connected to said thin film transistor through an opening provided in said organic resin film; wherein said semiconductor layer exhibits a peak of Raman spectra, displaced from 522 cm −1 to the lower frequency direction, and wherein said underlying insulating film contains halogen.
78. A device according to claim 77 wherein said pixel electrode is a transparent conductive film.
79. A device according to claim 77 wherein said material comprises silicon oxide.
80. A device according to claim 77 wherein said channel region comprises a material selected from the group consisting of silicon, germanium and a combination thereof.
81. A device according to claim 77 wherein said insulating film is 0.2 to 0.6 μm thick.
82. A device according to claim 77 consisting of 640×480 pixels arranged in a matrix form.
83. A device according to claim 77 consisting of 1260×960 pixels arranged in a matrix form.
84. A device according to claim 77 , wherein said organic resin film comprises polyimide.
85. A device according to claim 77 , wherein said channel region boron at concentration in a range of 1×10 15 –1×10 18 cm −3 .
86. A semiconductor device according to claim 77 , wherein said underlying insulating film prevents alkali metal atoms from getting into said semiconductor layer from said glass substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 2, 1999
December 26, 2006
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.