A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of attaching bond wires to a semiconductor device and package, the method comprising the steps of: providing an electrical ground; providing a rigid pedestal having a vacuum cavity and at least one conductive resilient member on a surface of said rigid pedestal; placing a component on said surface, said component comprising a package and an electrical device inside said package; holding said component against said surface using a vacuum applied to said vacuum cavity to form a ground connect between said component and said conductive resilient member; and attaching a bond wire to a bond pad on said package and a bond pad on said electrical device inside said package.
2. The method of claim 1 , wherein said providing a rigid pedestal further comprises providing a rigid pedestal having at least one conductive resilient member comprising an elastomer on a surface of said rigid pedestal.
3. The method of claim 1 , wherein said providing a rigid pedestal further comprising the step of providing a rigid pedestal having at least one conductive resilient member comprising a silicone elastomer on a surface of said rigid pedestal.
4. The method of claim 1 , wherein said providing a rigid pedestal further comprises providing a rigid pedestal having at least one conductive resilient member comprising a metal impregnated silicone elastomer on a surface of said rigid pedestal.
5. The method of claim 1 , wherein said providing a rigid pedestal further comprises providing a rigid pedestal having at least one conductive resilient member comprising a Ag—Cu filled elastomer on a surface of said rigid pedestal.
6. A method of holding a package and establishing a package-to-ground connection, comprising: providing a rigid pedestal having a recess formed in a surface of said rigid pedestal, said recess in communication with a vacuum source; providing a conductive resilient member coupled to an electrical ground; placing said package on said surface in a position such that said package covers said recess, and such that an electrical contact on said package engages said conductive resilient member; and creating a vacuum in said covered recess.
7. The method of claim 6 , further comprising providing a plurality of conductive resilient members.
8. The method of claim 7 , wherein said plurality of conductive resilient members comprises two conductive resilient members disposed at said surface on opposite sides of said recess.
9. The method of claim 6 , wherein said conductive resilient member comprises an elastomer impregnated with a metal.
10. The method of claim 6 , wherein said surface forms a conductive-resilient-member recess for receiving said conductive resilient member.
11. The method of claim 10 , wherein said providing a conductive resilient member comprises providing said conductive resilient member disposed in said conductive-resilient-member recess such that a portion of said conductive resilient member extends beyond said surface.
12. The method of claim 10 , wherein said conductive resilient member recess is formed in the shape of an elongated slot.
13. The method of claim 6 , further comprising creating a test circuit comprising said package and said conductive resilient member.
14. A method of wire bonding a semiconductor device contained in a package, the method comprising: providing an electrical ground; providing a rigid pedestal comprising a surface having a vacuum cavity; providing at least one conductive resilient member coupled to said electrical ground and disposed to electrically engage a ground contact of said package when said package is placed on said surface; placing said package on said surface; holding said component against said surface using a vacuum applied to said vacuum cavity; and attaching a bond wire to a bond pad on said package and to a bond pad on said semiconductor device.
15. The method of claim 14 , wherein said at least one conductive resilient member comprises a plurality of conductive resilient members.
16. The method of claim 15 , wherein each of the plurality of conductive resilient members are disposed within recesses formed in said surface.
17. The method of claim 16 , wherein each of the plurality of conductive resilient members protrude beyond said surface.
18. The method of claim 14 , further comprising performing a continuity test to confirm attachment of said bond wire.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 1, 2005
May 8, 2007
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