A heat-dissipating device with an isothermal plate assembly of predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation groove is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. A heat-dissipating unit composed of a plurality of heat-dissipating fins is assembled to a concave portion of the isothermal plate assembly of the predetermined shape. The upper plate and the lower plate are assembled with outer coupling unit and then a hot melting process is executed. The resultant product is then cooled to form a finished heat-dissipating device with an isothermal plate assembly of predetermined shape.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for manufacturing heat-dissipating device with isothermal plate assembly of a predetermined shape, the heat-dissipating device comprising an isothermal plate assembly having an upper plate and a lower plate with the predetermined shape, and a bending heat pipe placed therein, the heat-dissipating device further comprising a heat-dissipating unit with the predetermined shape, the method comprising the steps of: a. providing the shape upper plate and the lower plate with an accommodation groove defined therein; b. bending the upper plate and the lower plate to the predetermined shape first; then providing a flattened heat pipe and bending the flattened heat pipe to the predetermined shape; c. placing the bending heat pipe into the accommodation groove and assembling the upper plate and the lower plate to form the isothermal plate assembly with a concave portion; d. preparing the heat-dissipating unit and assembling the heat-dissipating unit to the isothermal plate assembly, applying a binding agent to a junction between the heat-dissipating unit and the isothermal plate assembly; e. sending the heat-dissipating unit and the isothermal plate assembly to an oven for melting the binding agent and forming a heat dissipating device with the isothermal plate assembly; f. removing and cooling the heat dissipating device; and g finishing the manufacture of the heat-dissipating device.
2. The method as in claim 1 , wherein the predetermined shape includes one of L shape, U shape, and S shape.
3. The method as in claim 1 , further comprising the step of: applying a binding agent on a contact face between the heat pipe and the upper plate and the lower plate, and another contact face between the upper plate and the lower plate, the binding agent being melted in the hot-melting process to seal a gap between the heat pipe and the upper plate and the lower plate.
4. The method as in claim 1 , further comprising the step of using outer coupling plates to clamp the upper plate and the lower plate together after the binding agent is applied; after assembling the upper plate and the lower plate, sending the assembled upper plate and lower plate to one of high temperature oven and re-flowing oven for a hot melting process; and cooling the assembled upper plate and lower plate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 5, 2005
July 3, 2007
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