The semiconductor device has a lead frame, a photo-detection chip and a control IC chip mounted on the lead frame, a first sealing portion that seals the photo-detection chip and the control IC chip, and a second sealing portion that covers the first sealing portion in a state of partially exposing the lens portion. The second sealing portion has a raised portion formed along the lens portion on the basal end side of the lens portion, which makes it possible to obtain a sufficient shielding effect against noise and therefore to improve tolerance to noise.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device comprising: a lead frame; a photo-detection element mounted on the lead frame; a signal processing section mounted on the lead frame and electrically connected to the photo-detection element; a first sealing portion made of a translucent resin, sealing the photo-detection element and the signal processing section, and having a lens portion; and a second sealing portion made of a conductive resin and covering the first sealing portion in a state of partially exposing the lens portion of the first sealing portion, the second sealing portion having a raised portion formed along the lens portion on a basal end side of the lens portion.
2. The semiconductor device as claimed in claim 1 , wherein the raised portion has a length of approximately 0.5 mm in an optical axis direction of the lens portion.
3. The semiconductor device as claimed in claim 1 , wherein the second sealing portion has a plurality of belt portions that extend along the lens portion from the raised portion to a fore end portion of the lens portion.
4. The semiconductor device as claimed in claim 3 , wherein both side surfaces of each of the belt portions are formed in a tapered shape so that an interval between both the side surfaces of each of the belt portions becomes narrower as located apart from a surface of the lens portion.
5. The semiconductor device as claimed in claim 3 , wherein each of the belt portions has a corner formed into a round shape.
6. The semiconductor device as claimed in claim 3 , wherein the belt portions have a thickness of not greater than approximately 0.4 mm in a direction perpendicular to the surface of the lens portion.
7. The semiconductor device as claimed in claim 3 , wherein a thickness of each of the belt portions in a direction perpendicular to the surface of the lens portion becomes smaller as located closer to the fore end portion of the lens portion.
8. The semiconductor device as claimed in claim 1 , wherein a gap is provided between the lens portion and the raised portion.
9. An electronic apparatus comprising the semiconductor device of claim 1 .
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 2, 2005
July 17, 2007
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