An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in said substrate such that the top surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An optical device package which comprises: (a) a substrate having an upper surface and an elongated linear groove for receiving an optical fiber; (b) an optical fiber positioned within the groove in said substrate and having a top surface; (c) a frame comprising a flat bottom surface, wherein the flat bottom surface is sealed to the upper surface of the substrate, the top surface of the optical fiber being at or below the level of the bottom surface of the frame; and (d) a lid bonded to the frame.
2. The optical device package of claim 1 , wherein the frame comprises a single piece member having a band-like structure defining an opening.
3. The optical device package of claim 2 , wherein the lid comprises a plate of fluid impervious material, the plate being bonded to the frame so as to cover the opening of the frame.
4. The optical device package of claim 3 , wherein the fluid impervious material is selected from the group consisting of silicon, glass, ceramic and metal.
5. The optical device package of claim 2 , wherein the substrate has a distal end, a proximal end, and a recess for receiving an optical semiconductor component, the recess extending to the proximal end of the substrate.
6. The optical device package of claim 5 , wherein the frame includes a projection dimensioned and configured to engage the recess.
7. The optical device package of claim 1 , wherein the substrate has a distal end, a proximal end and a recess, and the optical fiber extends from the recess to at least the distal end of the substrate.
8. The optical device package of claim 1 , wherein the substrate is fabricated from single crystal silicon.
9. The optical device package of claim 1 , further including an optical semiconductor component mounted to the substrate.
10. The optical device package of claim 9 , wherein the optical semiconductor component is selected from the group consisting of a laser diode, light emitting diode and photodetector.
11. The optical device package of claim 9 , wherein the optical semiconductor component has an active area positioned below the upper surface of the substrate.
12. The optical device package of claim 9 , wherein the optical semiconductor component has an active area positioned at or above the upper surface of the substrate, and the substrate possesses a reflecting surface for reflecting optical signals between the optical fiber and the active area.
13. An optical device package which comprises: (a) a substrate having an upper surface and an elongated linear groove for receiving an optical fiber; (b) an optical fiber positioned within the groove in said substrate and having a top surface; and (c) a frame comprising a flat bottom surface, wherein the flat bottom surface is sealed to the upper surface of the substrate, the frame being a single piece member having a band-like structure defining an opening, the top surface of the optical fiber being at or below the level of the upper surface of the substrate.
14. The optical device package of claim 13 , further comprising a lid.
15. The optical device package of claim 13 , wherein the substrate has a distal end, a proximal end, and a recess for receiving an optical semiconductor component, the recess extending to the proximal end of the substrate.
16. The optical device package of claim 13 , wherein the substrate is fabricated from single crystal silicon.
17. The optical device package of claim 13 , further including an optical semiconductor component mounted to the substrate.
18. The optical device package of claim 17 , wherein the optical semiconductor component has an active area positioned below the upper surface of the substrate.
19. The optical device package of claim 17 , wherein the optical semiconductor component has an active area positioned at or above the upper surface of the substrate, and the substrate possesses a reflecting surface for reflecting optical signals between the optical fiber and the active area.
20. An optical device package which comprises: (a) a substrate having an upper surface and an elongated linear groove for receiving an optical fiber; (b) an optical fiber positioned within the groove in said substrate and having a top surface; and (c) a frame comprising a single piece member having a band-like structure defining an opening and having a flat bottom surface, wherein the flat bottom surface is sealed to the upper surface of the substrate, the top surface of the optical fiber being at or below the level of the bottom surface of the frame.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 15, 2005
July 24, 2007
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