A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board has a manifold for intake and exhaust of refrigerant, and larger rack manifolds are substituted for rails and are attached to a backplane. A hybrid package including a ceramic hybrid power module and an attached array of cooling assemblies provide even more density of components and improved cooling.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A cooling system for electronic equipment enclosures with densely packed components comprising: an electronic equipment enclosure; a rack mounted within said enclosure; a plurality of boards mounted to said rack, at least one of said boards having a plurality of heat generating components mounted thereon; a plurality of microscale cooling assemblies each one of said cooling assemblies being connected to one of said plurality of heat generating components, each cooling assembly including a heat insulative housing, an inlet port formed in said housing for receiving a heat transferring fluid, an outlet port formed in said housing for passing said heat transferring fluid, a thermally conductive element connected to said housing, an evaporator chamber formed by said housing and said thermally conductive element upstream of said outlet port and a capillary passage formed in said housing between said inlet port and said evaporator chamber; a first intake manifold mounted to said rack; a first exhaust manifold mounted to said rack; a second intake manifold mounted to said board and to said first intake manifold; a second exhaust manifold mounted to said board and to said first exhaust manifold; a first fluid conduit connecting said board mounted second intake manifold and each of said plurality of cooling assemblies; a second fluid conduit connecting said board mounted second exhaust manifold and each of said plurality of cooling assemblies; a compressor; a third fluid conduit connecting said rack mounted first intake manifold and said compressor; and a fourth fluid conduit connecting said rack mounted first exhaust manifold and said compressor.
2. The system of claim 1 wherein: said rack includes a rail; and said plurality of boards are mounted to said rail.
3. The system of claim 1 including: a backplane connected to said rack; and wherein said plurality of boards are mounted to said backplane.
4. The system of claim 1 including: a backplane connected to said rack; and said first intake manifold and said first exhaust manifold are connected to said backplane.
5. The system of claim 1 including: a backplane connected to said rack; and wherein said rack includes a rail; said first intake manifold and said first exhaust manifold are connected to said backplane; and said plurality of boards are mounted to said rail and to said backplane.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 16, 2004
August 21, 2007
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