A lens module includes a lens seat, an image sensor unit, a lens set, a circuit board, and a resilient interposer. The lens seat includes a top wall that is formed with a barrel hole, a side wall that extends from a periphery of the top wall and that cooperates with the top wall to define a chamber, and a lens barrel. The lens barrel has a first barrel portion disposed in the chamber and a second barrel portion extending from the first barrel portion and passing through the barrel hole in the top wall. The image sensor unit and the lens set are disposed in the first and second barrel portions of the lens barrel, respectively. The circuit board is disposed to cover an open side of the lens seat, and is connected electrically to the image sensor unit via the resilient interposer.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A lens module comprising: a lens seat including a top wall that is formed with a barrel hole, a side wall that extends from a periphery of said top wall, that cooperates with said top wall to define a chamber, and that has a bottom end opposite to said top wall and defining an open side of said lens seat, and a lens barrel that has a first barrel portion disposed in said chamber and a second barrel portion extending from said first barrel portion, passing through said barrel hole in said top wall, and disposed outwardly of said chamber; an image sensor unit disposed in said first barrel portion; a lens set disposed in said second barrel portion; a circuit board disposed to cover said open side of said lens seat; and a resilient interposer disposed between and interconnecting electrically said image sensor unit and said circuit board.
2. The lens module as claimed in claim 1 , wherein said resilient interposer has a first contact surface in contact with said image sensor unit and a second contact surface in contact with said circuit board, at least one of said first and second contact surfaces being a wavy surface.
3. The lens module as claimed in claim 1 , further comprising an infrared ray filter disposed in said lens barrel between said lens set and said image sensor unit.
4. The lens module as claimed in claim 1 , wherein said image sensor unit is a CMOS image sensor and has one side formed with a conductive contact unit to connect electrically with said resilient interposer.
5. The lens module as claimed in claim 1 , wherein said image sensor unit is a CCD image sensor and has one side formed with a conductive contact unit to connect electrically with said resilient interposer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 16, 2007
October 2, 2007
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