Heating apparatus

1. A heating apparatus for a semiconductor producing system, said apparatus comprising: a heater having a mounting face for mounting a semiconductor, an opposed back face, an outer peripheral portion and an inner portion, said heater comprising a plate-shaped ceramic substrate having said mounting face, a first heating element embedded in said ceramic substrate in said outer peripheral portion and comprising a resistance heating material having a coil spring shape, a second heating element embedded in said ceramic substrate in said inner portion and comprising a resistance heating material that is independently controllable with respect to said first heating element, said second heating element having a coil spring shape, at least a pair of first terminals embedded in said ceramic substrate and connected with said first heating element and at least a pair of second terminals embedded in said ceramic substrate and connected with said second heating element; a supporting member, comprising a ceramic material, fixed to said back face of said heater in said inner portion, said supporting member having an outer surface, an inner surface facing an inner space and a length that is larger than a width thereof; first power supply means connected with said first terminal at said back face of said heater and contained in said inner space of said supporting member; second power supply means connected with said second terminal at said back face of said heater and contained in said inner space of said supporting member; at least a pair of first conductive connectors embedded in said ceramic substrate that are connected with ends of said first heating element, respectively, and with said first terminals, respectively, and that are not connected with said second heating element; and at least a pair of second conductive connectors embedded in said ceramic substrate that are connected with ends of said second heating element, respectively, and with said second terminals, respectively, and that are not connected with said first heating element; wherein said first heating element and said second heating element are provided substantially along the same plane in a manner such that said first and said second heating elements are not electrically connected with each other and such that each said first and said second heating elements are symmetrically arranged on opposing sides of a straight line of symmetry parallel with said plane; wherein said pair of first conductive connectors and said pair of second conductive connectors are provided in said plane, and said pair of first conductive connectors are provided between said pair of second conductive connectors in said inner portion; wherein said first and second terminals and said second conductive connectors are provided in said inner portion but are not present in said peripheral outer portion; wherein a distance WO between said pair of first terminals is less than a distance WI between said pair of second terminals; and wherein said first conductive connectors are provided in said inner portion and in said outer peripheral portion.