Method of fabricating a rat's nest RFID antenna

1. A method of fabricating an antenna on a substrate including a plurality of previously fabricated RFID chips, comprising: connecting the substrate with a carrier substrate; singulating the substrate to separate the plurality of RFID chips into a plurality of diesites; connecting in an assembly order, the antenna with a selected RFID chip to form a RFID tag; and repeating the connecting of another antenna with another RFID chip in the assembly order with each successively connected antenna overlapping a previously connected antenna.

2. The method as set forth in claim 1 and further comprising: removing each RFID tag from the carrier substrate in a disassembly order.

3. The method as set forth in claim 2 , wherein the disassembly order is opposite the assembly order.

4. The method as set forth in claim 2 , wherein the removing comprises heating a selected one of the substrate, the carrier substrate, or the substrate and the carrier substrate to effectuate the removing of each RFID tag from the carrier substrate.

5. The method as set forth in claim 2 , wherein the removing comprises using a pick-and-place machine to remove the RFID tag from the carrier substrate.

6. The method as set forth in claim 5 and further comprising: using the pick-and-place machine to attach the RFID tag to a host object.

7. The method as set forth in claim 2 and further comprising after the removing: encapsulating the RFID tag.

8. The method as set forth in claim 2 and further comprising after the removing: attaching the RFID tag with a host object.

9. The method as set forth in claim 8 and further comprising after the attaching: encapsulating the RFID tag.

10. The method as set forth in claim 1 , wherein the connecting the substrate with the carrier substrate comprises a selected one of adhesively connecting the substrate with the carrier substrate or gluing the substrate and the carrier substrate to each other.

11. The method as set forth in claim 10 , wherein the adhesively connecting comprises connecting the substrate with the carrier substrate using a layer of a double sided adhesive material.

12. The method as set forth in claim 1 , wherein the connecting the antenna comprises electrically connecting a first node of the antenna with a first node of the RFID chip and electrically connecting a second node of the antenna with a second node of the RFID chip.

13. The method as set forth in claim 12 , wherein the connecting comprises using a wire bonding machine to connect the first and second nodes of the antenna with the first and second nodes of the RFID chip.

14. The method as set forth in claim 1 , wherein the antenna is a loop antenna.

15. The method as set forth in claim 1 , wherein after the connecting, the antenna is positioned entirely within a quadrant defined by a diesite corner.

16. The method as set forth in claim 15 , wherein the antenna includes a first portion positioned inside a perimeter of the AFID chip and opposite the quadrant defined by the diesite corner and a second portion positioned outside the perimeter of the RFID chip the antenna is connected with, and the second portion includes an area that is greater than an area of the RFID chip.

17. The method as set forth in claim 1 , wherein a selected one of a shape of the antenna, a size of the antenna, or a shape of the antenna and a size of the antenna varies among the diesites.