Bonding program

1. A computer readable medium storing a bonding program that detects each one of positions of a plurality of positioning patterns disposed on a chip that is an object of bonding, calculates positions of bonding pads that are in a specified positional-relationship with the plurality of positioning patterns, and performs bonding in calculated positions of said bonding pads, wherein said bonding program comprises: a first reference-image acquisition process that makes an image of a first positioning pattern among a plurality of positioning patterns for a reference chip which is used as a reference for detection of positions of said positioning patterns, thus acquiring an image thus obtained as a first reference-image; a first object-image acquisition process that makes an image of a first positioning pattern for a chip that is an object of bonding, thus acquiring an image thus as a first object-image; a first positional-relationship calculation process that moves a first positioning pattern of said first reference-image and a first positioning pattern of said first object-image in relative terms so as to superimpose both of said images, so that a first positional-relationship which is a relative positional-relationship between a first positioning pattern of said reference chip and a first positioning pattern of said bonding object chip from an amount of said movement is calculated; an inclination-angle calculation process that calculates an inclination-angle of the first positioning pattern of the bonding object chip with respect to the first positioning pattern in the reference chip; a second reference-image acquisition process that makes an image of a second positioning pattern which is in a specified positional-relationship with the first positioning pattern for the reference chip, thus acquiring an image thus obtained as a second reference-image; an imaging-position calculation process that calculates a second positioning pattern imaging-position in which a second positioning pattern is imaged for the chip that is an object of bonding, wherein said second positioning pattern imaging-position is calculated based upon the first positional-relationship, the inclination-angle, a specified inter-pattern positional-relationship and the imaging-position in the first object-image acquisition step; a second object-image acquisition process that makes an image of a second positioning pattern for the bonding object chip in the calculated second positioning pattern imaging-position, thus acquiring the image thus obtained as a second object-image; and a second positional-relationship calculation process that moves the second reference-image end the second object-image in relative terms so as to superimpose the second positioning pattern of the second reference-image and the second positioning pattern of the second object-image, so that a second positional-relationship which is a relative positional-relationship between the second positioning pattern of the reference chip and the second positioning pattern of the bonding object chip from an amount of said movement is calculated; and positions of the bonding pads are calculated based upon the first positional-relationship and second positional-relationship, and bonding is performed.

2. The computer readable medium storing a bonding program according to claim 1 , wherein said inclination-angle calculation process comprises: a reference conversion origin specifying process that specifies a conversion origin that is used to subject the first reference-image to a polar coordinate conversion; a reference-image conversion process that performs a polar coordinate conversion on the first reference-image by way of using a specified reference conversion origin, thus producing a post-conversion reference-image; an object conversion origin specifying process that specifies the conversion origin that is used to subject the first object-image to a polar coordinate conversion by a positional-relationship that is the same as a positional-relationship between the first positioning pattern and the reference conversion origin in the first reference-image, based upon a calculated first positional-relationship; an object-image conversion process that performs a polar coordinate conversion on the first object-image by way of using a specified object conversion origin, thus producing a post-conversion object-image; and a relative inclination-angle calculation process that moves the post-conversion object-image and post-conversion reference-image in relative terms on a angular axis so that the first positioning pattern that has been subjected to a polar coordinate development in the post-conversion object-image and the first positioning pattern that has been subjected to a polar coordinate development in the post-conversion reference-image are superimposed, so that a relative inclination-angle between the positioning pattern of the reference chip and the positioning pattern of the bonding object chip is calculated from an angular amount of said movement; and said reference conversion origin specifying process comprises: a rotated image acquisition process that acquires a rotated image produced by rotating the first reference-image through a specified angle, and a pattern matching process that moves the first reference-image and the rotated image in relative terms, thus performing pattern matching so that the positioning pattern of the first reference-image and the positioning pattern of the rotated image are superimposed; and a reference conversion origin, which is such that an error in the relative positional-relationship between two positioning patterns detected by pattern matching of an image that is an object of comparison obtained by imaging-positioning patterns disposed in an attitude that includes positional deviation in a direction of rotation, and a first refrrence-image obtained by imaging-positioning patterns containing no positional deviation in a direction of rotation shows a minimal value, is specified, based upon results of the pattern matching.