A multi-step method for producing contactless tickets or cards, the tickets or cards including a chip (24) which is connected to an antenna (10) on a paper carrier. The method includes: printing the antennae in series on the paper carrier strip using a silkscreen ink; fixing a chip to each ticket by connecting bond pads of the chip to the antennas' bond pads (14, 16); and covering the paper strip, including the silkscreen-printed antenna and the corresponding chip, with an adhesive paper strip. After each step, the paper carrier strip is wound up before the next step is begun. Each of the silkscreen-printed antennae is coated with a protective layer (12) to prevent silkscreen ink from being transferred to the back of the paper carrier strip during the successive winding-up following each step.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for the multi-step manufacture of contactless tickets or cards including a chip connected to an antenna on a paper support, said method comprising printing in series, using screen printing ink, antennas on a paper support strip, in fixing a chip on each ticket by connecting the bonding pads of the chip to the bonding pads of the antenna and in covering said paper support strip comprising the screen-printed antennas and the corresponding chips with an adhesive paper strip, each of the steps being followed by the winding of said paper support strip before moving onto the next step; wherein said method includes a step comprising covering each of said screen-printed antennas with a protective layer, applied by printing, said protective layer being provided for preventing the screen printing ink from being transferred onto the back of the paper support strip during the successive windings thereof after each step.
2. The method according to claim 1 , wherein said protective layer is a dielectric layer.
3. The method according to claim 2 , wherein said dielectric layer is printed using a screen printing ink during screen printing the antenna onto the paper support.
4. The method according to claim 3 , wherein a part of said dielectric layer adapted to receive a conductive strip connecting the end of the screen-printed antenna to a bonding pad of the chip is greater than the rest of said dielectric layer.
5. The method according to claim 4 , wherein said part of the dielectric layer adapted to receive said conductive strip is made up of 100% dielectric, whereas the rest of said dielectric layer is made up of 30% dielectric.
6. The method according to claim 5 , wherein said print screen which is used to produce said dielectric layer comprises a full-tone screen corresponding to said part adapted to receive said conductive strip, whereas the rest of said dielectric layer is half-tone printed.
7. The method according to claim 1 , wherein said protective layer is applied by screen printing to said antenna.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 26, 2004
March 4, 2008
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