Methods of fabricating nano-gap electrode structures in array configurations, and the structures so produced. The fabrication method involves depositing first and second pluralities of electrodes comprising nanowires using processes such as lithography, deposition of metals, lift-off processes, and chemical etching that can be performed using conventional processing tools applicable to electronic materials processing. The gap spacing in the nano-gap electrode array is defined by the thickness of a sacrificial spacer layer that is deposited between the first and second pluralities of electrodes. The sacrificial spacer layer is removed by etching, thereby leaving a structure in which the distance between pairs of electrodes is substantially equal to the thickness of the sacrificial spacer layer. Electrode arrays with gaps measured in units of nanometers are produced. In one embodiment, the first and second pluralities of electrodes are aligned in mutually orthogonal orientations.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of fabricating a nano-gap electrode structure in an array configuration, comprising the steps of: forming a first plurality of first electrodes in an array, each of said plurality of first electrodes having a first electrode surface; depositing a sacrificial spacer layer having a first surface and a second surface defining a thickness of said sacrificial spacer layer upon said first electrode surface of at least one of said first electrodes, said first surface of said sacrificial spacer layer adjacent said first electrode surface of said first electrode; forming a second plurality of second electrodes in an array, each of said plurality of second electrodes having a first electrode surface, said second surface of said sacrificial spacer layer adjacent said first surface of at least one of said second plurality of second electrodes; and removing at least that portion of said sacrificial spacer layer having said first surface of said sacrificial spacer layer adjacent said first electrode surface of a selected one of said first plurality of first electrodes and said second surface of said sacrificial spacer layer adjacent said first electrode surface of at least one of said second plurality of second electrodes; whereby said first electrode surface of said selected one of said first plurality of first electrodes and said first electrode surface of at least one of said second plurality of second electrodes define an electrode gap having a dimension substantially equal to said thickness of said portion of said sacrificial spacer layer that was removed, said first electrode surface of said selected one of said first plurality of first electrodes and said first electrode surface of at least one of said second plurality of second electrodes configured to maintain said electrode gap dimension in response to an application of an electrical signal of sufficient magnitude to operate said three-dimensional nano-gap electrode structure in an array configuration.
2. A three-dimensional nano-gap electrode structure in an array configuration, comprising: a first plurality of first electrodes in an array, each of said plurality of first electrodes having a first electrode surface; and a second plurality of second electrodes in an array, each of said plurality of second electrodes having a first electrode surface, a first surface of at least one of said first plurality of first electrodes disposed at a separation distance from said first electrode surface of a selected one of said second plurality of second electrodes, said separation distance defined by a void resulting from removal of a sacrificial material, said separation distance being measured in a direction perpendicular to at least one of said first electrode surface of said first electrode and said first electrode surface of said second electrode, said first plurality of first electrodes and said second plurality of second electrodes configured to maintain said separation distance in response to an application of an electrical signal of sufficient magnitude to operate said three-dimensional nano-gap electrode structure in an array configuration; whereby said first electrode surface of one of said first plurality of first electrodes and said first electrode surface of one of said second plurality of second electrodes define a three-dimensional structure.
3. The three-dimensional nano-gap electrode structure in an array configuration of claim 2 , wherein said separation distance has a dimension of less than 10 nm.
4. The three-dimensional nano-gap electrode structure in an array configuration of claim 3 , wherein said separation distance has a dimension of less than 5 nm.
5. The three-dimensional nano-gap electrode structure in an array configuration of claim 2 , further comprising a substrate for supporting said three dimensional nano-gap electrode structure.
6. The three-dimensional nano-gap electrode structure in an array configuration of claim 5 , wherein said substrate is a semiconductor material.
7. The three-dimensional nano-gap electrode structure in an array configuration of claim 6 , wherein said semiconductor material is silicon.
8. The three-dimensional nano-gap electrode structure in an array configuration of claim 2 , further comprising an insulator layer upon said substrate for electrically insulating at least one electrode of said nano-gap electrode structure from said substrate.
9. The three-dimensional nano-gap electrode structure in an array configuration of claim 2 , further comprising electrical connection contacts connected to said first plurality of first electrodes and said second plurality of second electrodes, said electrical connection contacts configured to provide convenient electrical communication between said nano-gap electrode structure and another electrical device.
10. The three-dimensional nano-gap electrode structure in an array configuration of claim 2 , further comprising a lattice structure that mechanically supports at least one of said first plurality of first electrodes and said second plurality of second electrodes.
11. The three-dimensional nano-gap electrode structure in an array configuration of claim 2 , wherein at least one of said first plurality of first electrodes in an array and at least one of said second plurality of second electrodes in an array are disposed relative to one another in an orthogonal orientation.
12. A method of fabricating the nano-gap electrode structure of claim 2 , comprising the steps of: forming a first plurality of first electrodes in an array, each of said plurality of first electrodes having a first electrode surface; depositing a sacrificial spacer layer having a first surface and a second surface defining a thickness of said sacrificial spacer layer upon said first electrode surface of at least one of said first electrodes, said first surface of said sacrificial spacer layer adjacent said first electrode surface of said first electrode; forming a second plurality of second electrodes in an array, each of said plurality of second electrodes having a first electrode surface, said second surface of said sacrificial spacer layer adjacent said first electrode surface of at least one of said second plurality of second electrodes; and removing at least that portion of said sacrificial spacer layer having said first surface of said sacrificial spacer layer adjacent said first electrode surface of a selected one of said first plurality of first electrodes and said second surface of said sacrificial spacer layer adjacent said first electrode surface of at least one of said second plurality of second electrodes; whereby a structure according to claim 15 is produced wherein said first electrode surface of said selected one of said first plurality of first electrodes and said first electrode surface of at least one of said second plurality of second electrodes define an electrode gap having a dimension substantially equal to said thickness of said portion of said sacrificial spacer layer that was removed.
13. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 12 , further comprising the step of: providing a substrate for supporting said nano-gap electrode structure.
14. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 13 , further comprising the step of: providing a first adhesion layer between said substrate and at least one of said first plurality of first electrodes.
15. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 14 , wherein said first adhesion layer and said sacrificial spacer layer comprise a different material composition.
16. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 13 , wherein said substrate is a semiconductor material.
17. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 16 , wherein said semiconductor material is silicon.
18. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 13 , further comprising the step of: providing an insulator layer upon said substrate for electrically insulating at least one electrode of said nano-gap electrode structure from said substrate.
19. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 12 , further comprising the step of: defining a dimension of at least one of said first plurality of first electrodes in an array and said second plurality of second electrodes in an array by lithographic methods.
20. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 19 , wherein said dimension is a selected one of a width of a selected electrode, a separation between two adjacent electrodes in said first plurality of first electrodes, and a separation between two adjacent electrodes in said second plurality of second electrodes.
21. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 12 , further comprising the step of: defining a relative orientation between at least one of said first plurality of first electrodes in an array and at least one of said second plurality of second electrodes in an array by lithographic methods.
22. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 21 , wherein said relative orientation is an orthogonal orientation.
23. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 12 , further comprising the step of: forming a lattice structure that mechanically supports at least one of said first plurality of first electrodes and said second plurality of second electrodes.
24. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 12 , further comprising the step of: providing electrical connection contacts connected to said first plurality of first electrodes and said second plurality of second electrodes, said electrical connection contacts configured to provide convenient electrical communication between said nano-gap electrode structure and another electrical device.
25. The method of fabricating a nano-gap electrode structure in an array configuration according to claim 12 , wherein said thickness of said sacrificial spacer layer is less than ten nanometers.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 31, 2005
June 10, 2008
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