An aqueous seeding solution of palladium acetate, acetic acid and chloride.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A seeding solution for depositing a palladium seed on copper comprising an aqueous solution of palladium acetate, acetic acid, and hydrochloric acid.
2. The seeding solution of claim 1 wherein the aqueous solution of palladium acetate, acetic acid, and chloride comprises 0.01 g/l palladium acetate, 0.25 to 5 volume percent acetic acid and 3 to 10 ppm hydrochloric acid.
3. The seeding solution of claim 1 wherein the aqueous solution of palladium acetate, acetic acid, and chloride comprises 0.01 g/l palladium acetate, 0.25 to 1 volume percent acetic acid and 3 to 10 ppm hydrochloric acid.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 22, 2007
August 5, 2008
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