A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of wire bonding, comprising: attaching a multi-layered semiconductor chip structure having an overhang portion to a printed circuit board; aligning a heating block on a bottom area of the printed circuit board including aligning a support on the heating block to match the overhang portion of the semiconductor chip structure; inserting the support on the heating block through an opening in the printed circuit board; supporting the overhang portion of the semiconductor chip structure with the inserted support; and wire bonding the semiconductor chip structure and the printed circuit board.
2. The method of claim 1 , wherein attaching the multi-layered semiconductor chip structure to the printed circuit board includes: attaching a first chip to the printed circuit board; and attaching a second larger chip to the first chip.
3. The method of claim 1 , wherein attaching the multi-layered semiconductor chip structure to the printed circuit board includes attaching a plurality of multi-layered semiconductor chip structures to the printed circuit board, each multi-layered semiconductor chip structure having an overhang portion; aligning a support on the heating block to match the overhang portion of the semiconductor chip structure includes aligning a plurality of supports on the heating block to match the overhang portion of each semiconductor chip structure; inserting the support on the heating block through an opening in the printed circuit board includes inserting the plurality of supports on the heating block through a corresponding plurality of openings in the printed circuit board; and supporting the overhang portion of the semiconductor chip structure with the inserted support includes supporting the overhang portion of each of the plurality semiconductor chip structures with a corresponding inserted one of the plurality of supports.
4. The method of claim 1 , further comprising applying a vacuum pressure from a vacuum line in the heating block to the bottom area of the printed circuit board.
5. The method of claim 4 , further comprising applying a vacuum pressure from a vacuum line in the support to the overhang portion of the semiconductor chip structure.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 27, 2007
September 16, 2008
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