The sensing device (100) comprises a first sensing element (10) having a reference plane (1), between which sensing element (10) and a contacting side (3) of the device (100) a predefined angle is present. Conductors couple the sensing element (10) to external contacting means (30). The sensing device (100) is further provided with a body (21), which encapsulates the first sensing element (10) and at the same time acts as a carrier for the conductors, so that the contacting side (3) is a face of the body (21). The sensing device (100) may contain more than one sensing element (10,20), which are by preference magneto-resistive sensors. It can be suitably manufactured in that parts (21A, 21B) of the body are rotated with respect to the contacting side (3), the parts (21A, 21B) of the body having complementary shapes.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An electronic device comprising: contact means for external contacting, which are present at a contacting side of the electronic device; a first sensing element provided with a first reference plane, which defines a first predefined nonzero angle with the contacting side of the electronic device, a first electrical connection conductor that is coupled to both the contact means and the first sensing elements so as to provide a first electrical interconnection, and a first electrically insulating body positioning the first sensing element according to the first predefined nonzero angle, a second sensing element provided with a second reference plane which defines a second predefined nonzero angle with the contacting side of the electronic device, a second electrical connection conductor that is coupled to both the contact means and the second sensing elements so as to provide a second electrical interconnection, and a second electrically insulating body positioning the second sensing element according to the second redefined nonzero angle, wherein: the first electrically insulating body encapsulates the first sensing element, the second electrically insulating body encapsulates the second sensing element, a first top face of the first electrically insulating body faces a second top face of the second electrically insulating body, a third top face of the first electrically insulating body faces the contacting side of the electronic device, and a fourth top face of the second electrically insulating body faces the contacting side of the electronic device.
2. The electronic device as claimed in claim 1 , wherein at least one of the first sensing element and the second sensing element is suitable for sensing a magnetic field.
3. The electronic device as claimed in claim 1 , wherein at least one of the first sensing element and the second sensing element comprises a magneto-resistive sensor.
4. A method of manufacturing an electronic device comprising a first sensing element having a first reference plane, and an electrically insulating body of a desired shape engaged to position the first sensing element such that there is a predefined nonzero angle between the first reference plane and a contacting side of the device, the method comprising the acts of: providing a carrier having a first side and an opposed second side, at which first side a pattern of connection conductors is present, the carrier comprising contact means for external contacting; assembling the first sensing element at the first side of the carrier and electrically coupling the first element to at least one of the connection conductors; encapsulating the first sensing element with a molding technique into a first molded structure, such that the first molded structure has a first predefined shape and is provided with a first top face and a second top face; folding the carrier, thereby rotating the first molded structure with respect to the means for external contacting, so as to bring the first molded structure in a position in which the first reference plane of the sensing element and a plane through the means for external contacting mutually enclose the predefined nonzero angle, in which position the first top face is attached to the carrier or any structure present thereon, thereby forming the electrically insulating body, one side of which acts as contacting side at which the contact means are present.
5. The method as claimed in claim 4 , wherein, after the folding act, the first molded structure is fixed in its position by a gluing act.
6. the method as claimed in claim 4 , wherein the carrier comprises a base material which, after the encapsulation act, is removed at least partially, so as to provide contact windows from the first side to the second side.
7. the method as claimed in claim 4 , wherein: a second sensing element having a second reference plane is assembled at the first side of the carrier and electrically coupled to at least one of the connection conductors, after which it is encapsulated, using the molding technique, into a second molded structure provided with a second predefined shape comprising a third top face and a fourth top face; and the carrier is folded such that the second molded structure is rotated with respect to the first molded structure, so as to position the first and second molded structures with respect to the means for external contacting such as to bring the first molded structure in a position in which the first and second reference planes of the first and second sensing elements enclose the predefined angle, in which positions the third top face is attached to the carrier or any body thereon, and the second and fourth top faces face each other.
8. the method as claimed in claim 7 , wherein the second and fourth top faces are in contact with each other after the folding act.
9. method as claimed in claim 4 , wherein a plurality of electronic devices are manufactured simultaneously, which are mutually separated after the folding act.
10. A semi-manufactured article comprising sensing elements on a carrier, which may be subdivided into a plurality of individual devices, wherein: the carrier has a first side and an opposed second side, at which first side a repeated pattern of connection conductors is present, each pattern including, or corresponding to, means for external contacting; sensing elements are present at the first side of the carrier, are electrically coupled to at least one of the connection conductors and are encapsulated, using a molding technique, into molded structures, such that the molded structures have predefined shapes and are provided with first top faces and second top faces, wherein the first top faces face each other and the second top faces face the first side of the carrier.
11. The semi-manufactured article of claim 10 , wherein the molded structures include protruding portions which provide mechanical anchoring of the connection conductors.
12. The semi-manufactured article of claim 11 , wherein the protruding portions extend beyond the connection conductors.
13. The electronic device of claim 1 , wherein at least one of the first electrically insulating body and the second electrically insulating body includes a protruding portion which provides mechanical anchoring of at least one of the first electrical connection conductor and the second electrical connection conductor.
14. The electronic device of claim 13 , wherein the protruding portion extends beyond the at least one of the first electrical connection conductor and the second electrical connection conductor.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
August 30, 2004
November 4, 2008
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