Disclosed is a semiconductor memory device having a data retention operating mode. When an entry into the data retention operating mode is performed, parity information on data of the memory cells is calculated and the error correction on the memory cells is carried out at a time of an exit from the data retention operating mode, by an ECC (Error Correction Circuit). The semiconductor memory device includes means for outputting from an NC pin flag information indicating that the semiconductor memory device is the one including the data retention operating mode, that the exit processing from the data retention operating mode is under way, and that the error correction cannot be performed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor memory device comprising: a memory array including a plurality of memory cells, each requiring a refresh operation for data retention; and an ECC (Error Correction Circuit) for performing calculation of parity information on data of said memory cells and for performing error correction of said memory cells; said semiconductor memory device entering from a normal operation state into a data retention operating mode upon receipt of a command to enter into the data retention operating mode and for returning to the normal operation state upon receipt of a command to exit from the data retention operating mode; wherein the data retention operating mode includes: encode processing for performing calculation of parity information on data of said memory cells by said ECC when said semiconductor memory device enters into the data retention operating mode; self-refresh processing including a burst self-refresh state for intensively performing a self refresh on said memory cell array, a power-off state for turning off a part of an internal power supply circuit of said semiconductor memory device for a predetermined period, and a power-on state for returning said internal power supply circuit in an off state to an on state; and decode processing for performing error correction of said memory cells by said ECC upon receipt of the command to exit from the data retention operating mode; said semiconductor memory device further comprising a circuit for outpuffing flag information indicating an internal state of said semiconductor memory device from a predetermined output terminal.
2. A semiconductor memory device comprising: a memory array including a plurality of memory cells each requiring a refresh operation for data retention; an ECC (Error Correction Circuit) for performing a calculation of parity information on data of said memory cells when said semiconductor memory device enters into a data retention operating mode and performing error correction of said memory cells at a time of an exit from the data retention operating mode; and a circuit for outputting from a predetermined output terminal flag information indicating that said semiconductor memory device is the semiconductor memory device equipped with a function of the data retention operating mode.
3. The semiconductor memory device according to claim 2 , further comprising: a mode register in which initial setting of an operating mode of said semiconductor memory device is performed; and a circuit for performing control such that the flag information is output in response to input of a mode register setting command for performing setting of said mode register.
4. The semiconductor memory device according to claim 3 , wherein the flag information is output from said output terminal for a predetermined period.
5. The semiconductor memory device according to claim 4 , further comprising a circuit for performing control so that the output of the flag information is stopped responsive to the mode register setting command input after the predetermined period.
6. The semiconductor memory device according to claim 2 , further comprising a circuit for outputting from said predetermined output terminal flag information indicating that processing for the exit is under way when the exit from the data retention operating mode is performed.
7. The semiconductor memory device according to claim 6 , wherein a reentry into the data retention operating mode from the processing for the exit from the data retention operating mode is accommodated.
8. The semiconductor memory device according to claim 2 , further comprising a circuit for performing control so that when a reentry into the data retention operating mode is made during the processing for the exit from the data retention operating mode, the output of the flag information is stopped and said output terminal is set to a high impedance state.
9. The semiconductor memory device according to claim 2 , further comprising a circuit for outputting from said predetermined output terminal flag information indicating that the error correction cannot be performed when said ECC determines that the error correction cannot be performed during the processing for the exit from the data retention operating mode.
10. The semiconductor memory device according to claim 9 , wherein the flag information indicating that the error correction cannot be performed is output from said predetermined output terminal for a predetermined period after completion of the processing for the exit.
11. A semiconductor memory device comprising: a memory array including a plurality of memory cells each requiring a refresh operation for data retention; an ECC (Error Correction Circuit) for performing calculation of parity information on data of said memory cells when said semiconductor memory device enters into a data retention operating mode and performing error correction of said memory cells at a time of an exit from the data retention operating mode; and a circuit for outputting from a predetermined output terminal flag information indicating that a processing for the exit is under way when the exit from the data retention operating mode is performed.
12. The semiconductor memory device according to claim 11 , wherein a reentry into the data retention operating mode from the processing for the exit from the data retention operating mode is accommodated.
13. The semiconductor memory device according to claim 11 , further comprising: a circuit for outputting from said predetermined output terminal flag information indicating that the error correction cannot be performed when said ECC determines that the error correction cannot be performed during the processing for the exit from a function of the data retention operating mode.
14. The semiconductor memory device according to claim 13 , wherein the flag information indicating that the error correction cannot be performed is output from said predetermined output terminal for a predetermined period after completion of the processing for the exit.
15. The semiconductor memory device according to claim 12 , comprising a circuit for stopping the output of the flag information and setting said output terminal to a high impedance state when a reentry into the data retention operating mode is made during the processing for the exit from the data retention operating mode.
16. A semiconductor memory device comprising: a memory array including a plurality of memory cells each requiring a refresh operation for data retention; an ECC (Error Correction Circuit) for performing calculation of parity information on data of said memory cells when said semiconductor memory device enters into a data retention operating mode and performing error correction of said memory cells at a time of an exit from the data retention operating mode; a circuit for outpuffing from a predetermined output terminal flag information indicating that the error correction cannot be performed when said ECC determines that the error correction cannot be performed during a processing for the exit from the data retention operating mode.
17. The semiconductor memory device according to claim 16 , wherein the flag information indicating that the error correction cannot be performed is output from said predetermined output terminal for a predetermined period after completion of the processing for the exit.
18. The semiconductor memory device according to claim 1 , further comprising a resistive element connected between said output terminal for outputting the flag information and a higher potential power supply or between said output terminal and a lower potential power supply, so that when said output terminal is in the high impedance state, a potential of said output terminal becomes inverted from a potential when the flag information is in an active state.
19. The semiconductor memory device according to claim 1 , wherein said output terminal is set to the high impedance state before said output terminal outputs the flag information in the active state and after said output terminal has output the flag information.
20. The semiconductor memory device according to claim 1 , wherein said output terminal is a terminal selected from non-connection pins of said semiconductor memory device.
21. The semiconductor memory device according to claim 1 , wherein said output terminal for outputting the flag information is constituted from an input/output terminal selected from non-connection pins; and wherein said semiconductor memory device comprises a circuit for generating an internal reset signal by fixing said input/output terminal at a predetermined potential for a predetermined period.
22. The semiconductor memory device according to claim 21 , wherein said input/output terminal is employed as an input terminal for generating the internal reset signal when the flag information is not output from said input/output terminal.
23. The semiconductor memory device according to claim 22 , wherein when a clock enable signal controlling effectiveness and ineffectiveness of an input clock signal indicates a value making the clock signal ineffective, the flag information is not output from said input/output terminal, and said input/output terminal is employed as said input terminal for generating the internal reset signal.
24. A semiconductor memory device including: a memory cell array having a plurality of memory cells each requiring a refresh operation for data retention; at least one non-connection pin; said non-connection pin used for an input of a reset signal; and a circuit for generating an internal reset signal to initialize the memory device when the reset signal at the non-connection pin takes a predetermined electric potential for a predetermined period.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 17, 2005
December 9, 2008
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