A socket for an electrical tester is disclosed. The socket includes a first contact board being arranged at a bottom side of a test object, and a second contact board being arranged at a top side of the test object. The first contact board includes a first contact member and a first conductive connection member, wherein the first contact member is electrically connected to a bottom connection terminal formed on the bottom side of the test object, and the first conductive connection member is isolated from the test object. The second contact board includes a second contact member, wherein the second contact member is electrically connected to the first conductive connection member and a top connection terminal formed on a top side of the test object, respectively. Therefore, the socket can have a simple configuration for providing the test current.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A socket for an electrical tester comprising: a first contact board arranged at a bottom side of a test object and including a first contact member and a first conductive connection member, the first contact member being electrically connected to a bottom connection terminal formed on the bottom side of the test object, the first conductive connection member being isolated from the test object; and a second contact board arranged at a top side of the test object and including a second contact member, the second contact member being electrically connected to the first conductive connection member and a top connection terminal formed on a top side of the test object.
2. The socket of claim 1 , wherein the first contact member includes a pogo pin elastically contacting the bottom connection terminal.
3. The socket of claim 1 , wherein the second contact member comprises: a connection pin formed on the second contact board and electrically connected to the first conductive connection member; a conductive pattern extended from the connection pin; and a contact pin formed on the second contact board, extended from the conductive pattern, and electrically connected to the top connection terminal.
4. The socket of claim 1 , wherein the second contact board includes an opening part configured to expose the top side of the test object.
5. The socket of claim 1 , further comprising a connection structure connecting the first contact board to the second contact board.
6. The socket of claim 1 , wherein the test object includes a semiconductor package having a conductive ball corresponding to the bottom connection terminal and a bonding pad corresponding to the top connection terminal.
7. The socket of claim 1 , wherein the test object comprises a stack package including a plurality of laminated semiconductor packages, the stack package having a conductive ball corresponding to the bottom connection terminal and a bonding pad corresponding to the top connection terminal.
8. The socket of claim 7 , further comprising a third contact board interposed between the semiconductor packages and including a third contact member, the third contact member being electrically connected to the conductive ball and the bonding pad.
9. The socket of claim 8 , wherein the third contact board further includes a second conductive connection member configured to electrically connect the first conductive connection member to the second contact member.
10. The socket of claim 1 , further comprising: a socket body in which the first contact board is installed; and a socket lid connected to the socket body, the socket lid being configured to rotate with respect to the socket body to press the second contact board in a direction of the test object.
11. A socket for an electrical tester comprising: a first contact board arranged at a bottom side of a stack package and including a first contact member and a first conductive connection member, the stack package including a first semiconductor package and a second semiconductor package having a conductive ball and a bonding pad, the first contact member being electrically connected to the conductive ball of the first semiconductor package, the first conductive connection member being isolated from the stack package; a second contact board arranged at a top side of the second semiconductor package and including a second contact member, the second contact member being electrically connected to the first conductive connection member and the bonding pad of the second semiconductor package; a third contact board interposed between the first and second semiconductor packages and including a third contact member, the third contact member being electrically connected to the conductive ball of the second semiconductor package and the bonding pad of the first semiconductor package; and a connection structure configured to connect the first through third contact boards to each other.
12. The socket of claim 11 , wherein the second contact member comprises: a connection pin formed on the second contact board and electrically connected to the first conductive connection member; a conductive pattern extended from the connection pin; and a contact pin formed on the second contact board, extended from the conductive pattern, and electrically connected to the bonding pad of the second semiconductor package.
13. The socket of claim 11 , wherein the third contact board further includes a second conductive connection member electrically connecting the first conductive connection member to the second contact member.
14. The socket of claim 11 , further comprising: a socket body in which the first contact board is installed; and a socket lid connected to the socket body, the socket lid being configured to rotate with respect to the socket body to press the second contact board in a direction of the stack package.
15. A socket for an electrical tester comprising: a first contact board arranged at a bottom side of a test object and including a first contact member and a first conductive connection member, the first contact member being electrically connected to a bottom connection terminal formed on the bottom side of the test object, the first conductive connection member being isolated from the test object; a second contact board arranged at a top side of the test object and including a second contact member, the second contact member being electrically connected to the first conductive connection member and a top connection terminal formed on a top side of the test object; a socket body in which the first contact board is installed; and a socket lid connected to the socket body, the socket lid being configured to rotate with respect to the socket body to press the second contact board in a direction of the test object, wherein the test object includes a semiconductor package having a conductive ball corresponding to the bottom connection terminal and a bonding pad corresponding to the top connection terminal.
16. The socket of claim 15 , wherein the second contact member comprises: a connection pin formed on the second contact board and electrically connected to the first conductive connection member; a conductive pattern extended from the connection pin; and a contact pin formed on the second contact board, extended from the conductive pattern, and electrically connected to the top connection terminal.
17. The socket of claim 15 , wherein the semiconductor package is a stack package including a plurality of laminated semiconductor packages, the stack package having a conductive ball corresponding to the bottom connection terminal and a bonding pad corresponding to the top connection terminal.
18. The socket of claim 17 , further comprising a third contact board interposed between the semiconductor packages and including a third contact member, the third contact member being electrically connected to the conductive ball and the bonding pad.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 23, 2007
February 3, 2009
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