Image capturing device

1. An image capturing device comprising: an image sensor package, the image sensor package comprising: a substrate including a surface facing an object side of the image capturing device, and a cavity sunken from the surface in a direction away from the object side of the image capturing device; at least one passive component disposed within the cavity and electrically connected to the substrate; an insulative layer received in the cavity, the insulative layer encasing the at least one passive component; and an image sensor disposed on the insulative layer and electrically connected to the substrate, a lens module attached to the image sensor package, the lens module comprising: a barrel with at least one lens received therein, the at least one lens aligned with the image sensor; and a holder with an end connecting with the barrel and an opposite end secured on the substrate.

2. The image capturing device as claimed in the claim 1 , wherein a width and a length of the cavity are respectively larger than that of the image sensor; the depth of the cavity being greater than a height of the passive component.

3. The image capturing device as claimed in the claim 2 , wherein the image sensor is partially received in the cavity.

4. The image capturing device as claimed in the claim 2 , wherein the image sensor is totally received within the cavity.

5. The image capturing device as claimed in the claim 1 , wherein the substrate further includes a plurality of welding pads formed on the surface of the substrate facing the object side of the image capturing device, the first welding pads being configured for electrically coupling the image sensor to the substrate.

6. The image capturing device as claimed in the claim 5 , wherein the image sensor is coupled to the first welding pads using a plurality of wires, the first welding pads and the wires are embedded in a curable adhesive.

7. The image capturing device as claimed in the claim 6 , wherein the image sensor package further comprises a cover disposed over the curable adhesive.

8. The image capturing device as claimed in the claim 1 , wherein the substrate further includes a plurality of welding pads formed on another surface of the substrate away from the object side of the image capturing device, the welding pads being configured for coupling the image sensor package to an outside circuit.

9. The image capturing device as claimed in the claim 8 , wherein the welding pads are patterned in a form selected from a group consisting of BGA, LCC or leadframe.

10. The image capturing device as claimed in the claim 1 , wherein the material of the substrate is selected from a group consisting of plastic, ceramic or glass.

11. The image capturing device as claimed in the claim 1 , wherein the substrate can be made from a compound selected from a group consisting of epoxy resin doped with organic silicon, epoxy resin doped with glass fiber, and epoxy resin doped with aramid fibers.

12. The image capturing device as claimed in the claim 1 , wherein the insulative layer is made from curable adhesive, the image sensor being directly attached on the insulative layer.

13. The image capturing device as claimed in the claim 1 , wherein the material of the barrel is selected from the group consisting of polycarbonate, acrylonitrile-butadiene-styrene, and any combinations thereof.

14. The image capturing device as claimed in the claim 1 , wherein the barrel has a focus-adjusting ring arranged at an end of the barrel away from the image sensor package.

15. The image capturing device as claimed in the claim 14 , wherein the focus-adjusting ring is integrally formed with the barrel.

16. The image capturing device as claimed in the claim 1 , wherein anti-reflection coatings are coated on opposite two surfaces facing along the direction of the optical axis of the lens, of the lens.

17. An image capturing device comprising: a substrate comprising a surface facing an object side of the image capturing device, and a cavity sunken from the surface in a direction away from the object side of the image capturing device; an insulative layer received in the cavity; at least one passive component embedded in the insulative layer in the cavity and electrically connected to the substrate; an image sensor attached to the insulative layer and electrically connected to the substrate; a holder secured to the substrate; and a barrel with at least one lens received therein attached to the holder; wherein the image sensor is aligned with the at least one lens and at least partly overlapped with the at least one passive component in a direction parallel to an optical axis of the at least one lens.

18. The image capturing device as claimed in the claim 17 , further comprising a transparent cover disposed on an adhesive which is attached around the image sensor, wherein the cover cooperates with the adhesive to seal a sensitive area of the image sensor.

19. The image capturing device as claimed in the claim 18 , wherein a plurality of welding pads is formed on the surface of the substrate facing the object side of the image capturing device, the welding pads electrically coupled to the substrate are electrically coupled to the image sensor via wires, the welding pads and the wires embedded in the curable adhesive.

20. The image capturing device as claimed in the claim 18 , wherein the cover is adhered to the holder another adhesive.