An imaging apparatus includes: a three-dimensional substrate in which a partition wall (11) having an opening (10a) at a central portion is formed so as to cross an inner cavity; an optical filter (5) that is fixed on a first flat surface (12) of both surfaces of the partition wall so as to cover the opening; a semiconductor imaging device (4) that is face-down mounted on a second flat surface (13) of the partition wall with an imaging area (4a) facing the opening; and an optical system for forming images that is installed on a side of the optical filter in the inner cavity of the three-dimensional substrate. The opening of the partition wall is dosed on both sides with the optical filter and the semiconductor imaging device so as to form a cavity. An air passage (12a) for allowing communication between the cavity and an exterior of the three-dimensional substrate is formed on the first flat surface, and has a labyrinth structure that causes a flow rate of air passing through the air passage to vary depending on a location in the air passage. This allows air circulation between the exterior and a cavity enclosed by a semiconductor imaging device and an optical filter, while suppressing the entry of foreign matter from the exterior into the cavity via an airflow caused by expansion/contraction of air.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An imaging apparatus, comprising: a three-dimensional substrate in which a partition wall having an opening at a central portion is farmed so as to cross an inner cavity; an optical filter that is fixed on a first flat surface of both surfaces of the partition wall so as to cover the opening; a semiconductor imaging device that is face-down mounted on a second flat surface of the partition wall with an imaging area facing the opening; and an optical system for forming images that is installed on a side of the optical filter in the inner cavity of the three-dimensional substrate, the opening of the partition wall being closed on both sides with the optical filter and the semiconductor imaging device so as to form a cavity, wherein an air passage for allowing communication between the cavity and an exterior of the three-dimensional substrate is formed as a groove on the first flat surface, the groove having a labyrinth structure that causes a variation of a flow rate of air passing through the air passage depending on a location along the air passage.
2. The imaging apparatus according to claim 1 , wherein the labyrinth structure of the air passage is defined by a zigzag shape, a shape inclined as a whole or a circular-arc shape.
3. The imaging apparatus according to claim 1 , wherein the labyrinth structure of the air passage is formed by providing a rib crossing the air passage so that a height of the air passage in a thickness direction of the optical filter varies along a flow direction of the air passage.
4. The imaging apparatus according to claim 1 , wherein the labyrinth structure of the air passage is formed by providing a concave part on a side edge of the air passage so that a width of the air passage within the first flat surface varies along the flow direction of the air passage.
5. The imaging apparatus according to claim 1 , wherein the three-dimensional substrate has such a low light transmittance with respect to a region sensitive to light reception by the semiconductor imaging device that substantially no unwanted signal is generated.
6. The imaging apparatus according to claim 1 , wherein the air passages are located at a position axisymmetric with respect to the opening in the three-dimensional substrate.
7. A method for manufacturing an imaging apparatus that uses a three-dimensional substrate in which a partition wall having an opening at a central portion is formed so as to cross an inner cavity, an air passage with a non-linear structure for allowing communication between the opening and an exterior of the three-dimensional substrate is formed on a first flat surface of both surfaces of the partition wall, and a conductor land for connection is provided on a second flat surface of the partition wall, comprising process steps of: fixing an optical filter on the first flat surface by bonding; installing a semiconductor imaging device with respect to the conductor land for connection provided on the second flat surface; sealing the semiconductor imaging device; and subsequently installing an optical system for forming images in the inner cavity of the three-dimensional substrates, wherein the air passage is formed as a groove having a labyrinth structure that causes a variation of a flow rate of air passing through the air passage depending on a location along the air passage.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 26, 2004
May 19, 2009
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