276-pin buffered memory module with enhanced fault tolerance

1. A dual inline memory module (DIMM), comprising: a card; a plurality of individual local memory devices attached to said card; a buffer device attached to said card, said buffer device configured for converting a packetized memory interface; and at least 200 pins configured on the card, wherein a first portion of said pins is configured to operate at a first supply voltage, and a second portion of said pins is configured to operate at a second supply voltage, the pins including: a plurality of high-speed bus interface pins for communicating with a plurality of high-speed busses for implementing a cascade connection to one or more of an upstream DIMM, a downstream DIMM, and an upstream memory controller with respect to said DIMM; and a plurality of redundant pins, wherein a given redundant pin with respect to a signal pin is located directly behind said signal pin.

2. The DIMM of claim 1 , further comprising a positioning key formed on said card, wherein said positioning key is located at a non-center position with respect to a length of the card.

3. The DIMM of claim 1 , wherein 276 pins are arranged in a first row of pins and a second row of pins behind said first row and wherein each said row of pins includes 138 pins.

4. The DIMM of claim 1 further comprising error code correction (ECC) logic for identifying and correcting faults on said high-speed busses.

5. The DIMM of claim 1 wherein the pins for the high speed busses are used for the transfer of address, command, data and clocks between said pins and said buffer device.

6. The DIMM of claim 1 , further comprising numerous components such as capacitors, resistors and, EEPROM(s).