Heat dissipation device having a fixing base

1. A heat dissipation device adapted for dissipating heat generated by a chipset mounted on a printed circuit board, comprising: a fixing base having a pair of side plates formed on a first set of two opposite sides thereof and at least a pressing beam formed across a second set of two opposite sides thereof, each side plate comprising at least a resilient barb extending inwards from an end portion thereof; and a heat sink attached with the chipset, being positioned between the fixing base and the chipset, the heat sink comprising a base having two opposite sides abutting a first set of two opposite sides of the chipset to avoid movement of the heat sink along a direction perpendicular to the two opposite sides of the base; wherein the resilient barbs of the fixing base tightly clasp a second set of two opposite sides of the chipset and the at least a pressing beam presses the heat sink toward the chipset; wherein the heat sink comprises two opposite flanges formed on the two opposite sides of the base of the heat sink; and wherein the two opposite flanges of the heat sink abut the first set of two opposite sides of the chipset, and the resilient barbs of the fixing base abut the second set of two opposite sides of the chipset.

2. The heat dissipation device as claim 1 , wherein the fixing base is made of resilient plastic and is a substantially rectangular frame.

3. The heat dissipation device as claim 2 , wherein the at least a pressing beam has an arched-shaped configuration and comprises a lower portion pressing towards the heat sink.

4. The heat dissipation device as claim 1 , wherein the at least a pressing beam has two ends integral with the second set of two opposite sides of the fixing base.

5. The heat dissipation device as claim 1 , wherein the chipset is received between the two flanges of the base of the heat sink.

6. The heat dissipation device as claim 5 , wherein the heat sink is blocked by the chipset abutting against the flanges in a direction perpendicular to the flanges.

7. A heat dissipation device comprising: a heat-generating device; a heat sink having two flanges formed on first two opposite sides thereof, the flanges abutting first two opposite sides of the heat-generating device; a fixing base having two side plates formed at two opposite sides thereof, the side plates clasping second two opposite sides of the heat-generating device and abutting second two opposite sides of the heat sink, the fixing base further comprising at least a pressing beam having two ends integral with the fixing base, the at least a pressing beam pressing the heat sink toward the heat-generating device.

8. The heat dissipation device as claim 7 , wherein the heat sink has a plurality of fins and the at least a pressing beam is located between the fins.

9. The heat dissipation device as claim 7 , wherein the two ends of the at least a pressing beam are integral with the fixing base at two opposite sides thereof which are other than the opposite sides at which the side plates are formed.

10. The heat dissipation device as claim 7 , wherein the two flanges of the heat sink define a receiving space receiving the heat-generating device between the two flanges.

11. The heat dissipation device as claim 10 , wherein the heat sink is blocked by the heat-generating device abutting against the flanges in a direction perpendicular to the flanges.