Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices

1. A method for electroplating copper directly onto a copper diffusion barrier layer deposited on a patterned substrate and, in the same step of the method, filling surface features of the patterned substrate with copper, said method comprising: providing an electrolytic copper bath containing, in solution in a solvent, a source of copper ions with a concentration of between 45 and 200 mM, and at least one copper complexing agent, which is an aliphatic polyamine having 2 to 4 amine functions, with a concentration of between 30 and 200 mM; a copper/complexing agent(s) molar ratio being of between 0.2 and 2; bringing said copper diffusion barrier layer of said substrate into contact with said electrolytic copper bath, applying an electrical bias to the substrate for a duration adjusted according to the thickness of copper to be electroplated, so as to electroplate copper directly onto the copper diffusion barrier layer and fill the surface features of the patterned substrate with copper, and removing the substrate from said electrolytic copper bath.

2. The method of claim 1 , wherein the electrical bias has the form of a series of periodic pulses of current or potential, having a magnitude depending on the barrier.

3. The method of claim 1 , wherein the electrical bias has the form of a continuous potential or current polarization having a magnitude depending on the barrier material.

4. The method of claim 1 , wherein said aliphatic polyamine is selected from the group consisting of alkylene-polyamines and polyalkylene-polyamines having 2 to 4 amine functions.

5. The method of claim 4 , wherein said aliphatic polyamine is selected from the group consisting of ethylenediamine and diethylenetriamine.

6. The method of claim 4 , wherein the aliphatic polyamine is at least one selected from the group consisting of ethylenediamine, diethylenetriamine, triethylenetetramine, and dipropylenetriamine.

7. The method of claim 1 , wherein said electrolytic copper bath essentially contains, in solution in a solvent a source of copper ions with a concentration of between 45 and 100 mM, and at least one copper complexing agent which is an aliphatic polyamine having 2 to 4 amine functions with a concentration of between 60 and 200 mM; the copper/complexing agent(s) molar ratio being of between 0.3 and 1.5.

8. The method of claim 1 , wherein, in the aforementioned electrolytic copper bath, the aforementioned solvent is chosen from water and hydroalcoholic mixtures and the source of copper ions is a copper salt.

9. The method of claim 8 , wherein the copper salt is selected from the group consisting of copper sulphate, copper chloride, copper nitrate and copper acetate.

10. The method of claim 8 , wherein the copper salt is copper sulphate.

11. The method of claim 1 , wherein the aforementioned substrate is a silicon wafer in the course of fabricating integrated circuits, the surface of which, to be coated, is that of a copper diffusion barrier layer selected from the group consisting of a bilayer based on tantalum nitride/tantalum (TaN/Ta), a tantalum nitride (TaN) layer, a tantalum silicon nitride (TaSiN) layer, a titanium (Ti) layer, a titanium nitride (TiN) layer, a titanium silicon nitride (TiSiN) layer, a tungsten nitride (WN) layer, a tungsten carbon nitride (WCN) layer, a cobalt-based layer and a ruthenium-based layer.

12. The method of claim 1 , wherein the concentration of the source of copper ions is between 45 and 100 mM.

13. The method of claim 1 , wherein the concentration of the at least one copper complexing agent is between 60 and 200 mM.

14. The method of claim 1 , wherein the copper/complexing agent(s) molar ratio is between 0.3 and 1.5.

15. The method of claim 1 , wherein the concentration of the source of copper ions is between 50 and 80 mM.

16. The method of claim 1 , wherein the concentration of the copper complexing agent is between 90 and 180 mM.

17. The method of claim 1 , wherein the copper/complexing agent(s) molar ratio is between 0.4 and 0.8.