In a method of creating an electroluminescent device, a plurality of organic electroluminescent pixels (10) are created on a transparent substrate (7), active electronic circuitry (14) is created on a second separate substrate (15), and the two substrates are assembled together with the active electronic circuitry (14) facing the transparent substrate (7) in such a manner as to form discrete electrical connections (17) between the active electronic circuitry and the organic light emitting diode pixels (10). An insulating matrix material (18) can then be used to fill the space between the substrates (7, 15).
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of creating an electroluminescent device including a plurality of pixels, comprising the steps of: creating a plurality of organic electroluminescent elements on a transparent substrate; creating active electronic circuitry on a second separate substrate; and assembling together the two substrates with the active electronic circuitry facing the transparent substrate in such a manner as to form discrete electrical connections between the active electronic circuitry and the organic electroluminescent elements with the active electronic circuitry of each pixel being placed directly behind the electroluminescent element of the pixel to which it corresponds.
2. A method according to claim 1 , wherein said transparent substrate is coated with an electrically conducting transparent material.
3. A method according to claim 2 , wherein the transparent conducting material comprises indium tin oxide.
4. A method according claim 1 , further comprising the step of creating areas of insulating material providing electrically isolating barriers between pixels.
5. A method according to claim 1 , wherein emissive material used in the organic electroluminescent elements is selected from a group consisting of a polymer, oligomer, small molecule material, and rare earth chelate material.
6. A method according to claim 4 , wherein said insulating material is light-absorbing or light-reflecting.
7. A method according to claim 1 , wherein a second electrode of each pixel comprises a thinner layer of a one of a reactive metal and a reactive metal compound arranged between the electroluminescent material of the pixel and a thicker layer of a metallic material less reactive than said one of said reactive metal and said reactive metal compound.
8. A method according to claim 1 , wherein the electrical connections between the substrates comprise a connection material selected from a group consisting of conductive adhesive, metal, and anisotropic conductive material.
9. A method according to claim 8 , wherein the electrical connection material is deposited onto contact pads of one or both substrates by a method selected from screen-printing, stencil-printing and ink-jet printing.
10. A method according to claim 9 , wherein a plurality of connections on at least one of the substrates is formed by depositing the connection material in a plurality of locations simultaneously on the respective substrate.
11. A method according to claim 1 , wherein the substrates are connected together by ultrasonic bonding.
12. A method according to claim 1 , wherein a fluid insulating material is introduced and fills the gaps between the electrical connections between the two substrates and is then converted into a solid matrix.
13. A method according to claim 12 , wherein the matrix comprises a material which improves the thermal expansion properties between different materials in the device.
14. A method according to claim 13 , wherein the matrix further comprises a desiccant or getter.
15. A method according to claim 1 , wherein at least one of the substrates is of plastics material.
16. A method according to claim 1 , wherein at least one of the substrates is flexible.
17. A method according to claim 1 , wherein at least one of the substrates is non-planar.
18. A method according to claim 1 , wherein the active electronic circuitry is created on a plurality of active circuit chips, which chips are combined with the second separate substrate.
19. A method according to claim 1 , wherein a plurality of transparent substrates with different properties are combined with a single second separate substrate.
20. A method according to claim 1 , wherein said second substrate comprises a material selected from crystalline silicon, amorphous silicon, polysilicon, silicon on insulator, or an electrically conducting organic material.
21. An electroluminescent device including a plurality of pixels comprising a plurality of organic electroluminescent elements on a suitable transparent substrate, and active electronic circuitry on a second separate substrate, said transparent and active substrates being connected by discrete electrical connections between the active electronic circuitry and the organic light emitting diode elements, a cured, non-fluid, non-conducting matrix material being located between the transparent and active substrates, and the active electronic circuitry of each pixel being placed directly behind the electroluminescent element of the pixel to which it corresponds.
22. An electroluminescent device according to claim 21 , wherein said second substrate comprises a material selected from crystalline silicon, amorphous silicon, polysilicon, silicon on insulator, or an electrically conducting organic material.
23. An electroluminescent device including a plurality of pixels produced by a process comprising the steps of: creating a plurality of organic electroluminescent elements on a transparent substrate; creating active electronic circuitry on a second separate substrate; and assembling together the two substrates with the active electronic circuitry facing the transparent substrate in such a manner as to form discrete electrical connections between the active electronic circuitry and the organic electroluminescent elements with the active electronic circuitry of each pixel being placed directly behind the electroluminescent element of the pixel to which it corresponds.
24. An electroluminescent device according to claim 23 , wherein said second substrate comprises a material selected from crystalline silicon, amorphous silicon, polysilicon, silicon on insulator, or an electrically conducting organic material.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 21, 2002
September 29, 2009
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