A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on the soft-magnetic, multi-layer substrate; the semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of the switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; the soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of the multi-layer substrate and a periphery of the laminated coil, and second external terminals formed on a second main surface; and terminals of the semiconductor integrated circuit device being connected to the first external terminals on the multi-layer substrate, at least part of the first external terminals being electrically connected to the second external terminals through the first and second connecting wires, and the input or output terminal being connected to the second external terminals via the laminated coil.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on said soft-magnetic, multi-layer substrate, said semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of said switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; said soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of said multi-layer substrate and a periphery of said laminated coil, and second external terminals formed on a second main surface; and terminals of said semiconductor integrated circuit device being connected to said first external terminals on said multi-layer substrate, at least part of said first external terminals being electrically connected to said second external terminals through said first and second connecting wires, and said input or output terminal being connected to said second external terminals via said laminated coil.
2. The DC-DC converter according to claim 1 , which is of a multi-phase type, in which pluralities of output terminals of said semiconductor integrated circuit device are connected to one ends of different laminated coils, while the other ends of said laminated coils are connected to the second common external terminals.
3. The DC-DC converter according to claim 1 , wherein said semiconductor integrated circuit device has a negative feedback terminal, and wherein said first external terminal connected to said negative feedback terminal is connected to the other end of the laminated coil connected to said output terminal.
4. The DC-DC converter according to claim 1 , wherein capacitance elements are connected to the first external terminals formed on the first main surface of said multi-layer substrate, and wherein the input and/or output terminals of said semiconductor integrated circuit device are connected to the ground.
5. The DC-DC converter according to claim 1 , wherein said multi-layer substrate has first common connecting wires connected to pluralities of ground terminals of said semiconductor integrated circuit device, and wherein pluralities of second connecting wires are connected to said first common connecting wires.
6. The DC-DC converter according to claim 1 , wherein said second connecting wires are formed by conductor strips on the side surface of said multi-layer substrate.
7. The DC-DC converter according to claim 1 , wherein said second connecting wires are formed by via-holes passing through pluralities of layers in a thickness direction.
8. The DC-DC converter according to claim 1 , wherein part of said second connecting wires are exposed on the side surface of said multi-layer substrate, and the remainder of the second connecting wires are formed in the multi-layer substrate.
9. The DC-DC converter according to claim 1 , wherein the width of said first connecting wires is expanding toward said second connecting wires.
10. The DC-DC converter according to claim 1 , which has a magnetic gap at least in a region inside said laminated coil formed in said multi-layer substrate.
11. The DC-DC converter according to claim 1 , wherein said multi-layer substrate comprises a region having said laminated coil, and upper and lower insulating layer regions above and below it, said upper insulating layer region having a magnetic shield formed by a conductor pattern.
12. The DC-DC converter according to claim 1 , wherein said multi-layer substrate comprises a region having said laminated coil, and upper and lower insulating layer regions above and below it, at least said upper insulating layer region having a recess in said first main surface.
13. The DC-DC converter according to claim 1 , wherein said semiconductor integrated circuit device is mounted on a region of said first main surface inside the laminated coil.
14. The DC-DC converter according to claim 1 , wherein said multi-layer substrate has an insulating layer made of glass, a dielectric material or a low-permeability magnetic material at least on the first main surface.
15. The DC-DC converter according to claim 1 , wherein the first main surface of said multi-layer substrate is covered with a resin.
16. The DC-DC converter according to claim 1 , which comprises a metal case connected to the first connecting wires formed on the first main surface of said multi-layer substrate and connected to the ground.
17. The DC-DC converter according to claim 7 , wherein at least part of said via-holes are exposed on the side surface of said multi-layer substrate.
18. The DC-DC converter according to claim 10 , wherein said multi-layer substrate comprises a region having said laminated coil, and upper and lower insulating layer regions above and below it, at least said upper insulating layer region having said magnetic gap.
19. The DC-DC converter according to claim 10 , wherein said magnetic gap is a space.
20. The DC-DC converter according to claim 10 , wherein said magnetic gap is formed by a non-magnetic material, a low-permeability magnetic material or a dielectric material.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 30, 2006
January 12, 2010
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