Methods of forming a solder structure may include providing a wafer including a plurality of die therein, and a solder wettable pad may be formed on one of the die adjacent an edge of the die. The solder wettable pad may have a length parallel to the edge of the die and a width perpendicular to the edge of the die wherein the length parallel to the edge of the die is greater than the width perpendicular to the edge of the die. A solder bump may be plated on the solder wettable pad, and the die may be separated from the wafer along the edge of the die after plating the solder bump on the solder wettable pad. Moreover, the solder bump may be reflowed on the solder wettable pad so that the solder structure extends laterally from the solder wettable pad beyond the edge of the die after separating the die from the wafer. Related structures are also discussed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A solder structure comprising: a substrate; a solder wettable pad on the substrate adjacent an edge of the substrate, the solder wettable pad having a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length parallel to the edge of the substrate is greater than the width perpendicular to the edge of the substrate, and wherein the solder wettable pad is set back from the edge of the substrate by at least 20 microns; and a solder bump on the solder wettable pad wherein the solder bump extends laterally from the solder wettable pad toward the edge of the substrate at least to within 10 microns of the edge of the substrate.
2. A solder structure according to claim l wherein the solder bump extends laterally from the solder wettable pad beyond the edge of the substrate.
3. A solder structure according to claim 1 wherein the solder bump extends laterally from the solder wettable pad to the edge of the substrate.
4. A solder structure according to claim 1 further comprising: a solder wettable reservoir connected to the solder wettable pad, the solder wettable reservoir having a width at a connection with the solder wettable pad that is less than the width of the solder wettable pad.
5. A solder structure according to claim 4 wherein the width of the solder wettable pad is at least 10% greater than a greatest width of the solder wettable reservoir.
6. A solder structure according to claim 4 wherein an angle of a junction between the solder wettable pad and the solder wettable reservoir comprises an acute angle.
7. A solder structure according to claim 4 wherein the solder wettable reservoir includes a flared narrowing therein.
8. A solder structure according to claim 4 wherein the solder wettable reservoir includes a two branches that join at a junction with the junction being between the two branches and the connection with the solder wettable pad, wherein each branch narrows by at least 20% at the junction therebetween.
9. A solder structure according to claim 4 wherein the solder wettable reservoir includes a bight therein wherein the bight includes an opening at least 2.5 times a radius of curvature of the bight.
10. A solder structure according to claim 1 further comprising: first and second solder wettable reservoirs connected to opposing ends of the solder wettable pad.
11. A solder structure according to claim 10 wherein the connections of the solder wettable reservoirs to the solder wettable pad are separated by the length of the solder wettable pad parallel to the edge of the substrate.
12. A solder structure according to claim 10 wherein portions of the first and second solder wettable reservoirs connected to the solder wettable pad have respective widths that are less than the width of the solder wettable pad.
13. A solder structure according to claim 1 further comprising: a second substrate adjacent the edge of the first substrate, wherein the first and second substrates are not parallel and wherein the solder bump is connected to the second substrate.
14. A solder structure according to claim 13 wherein the first and second substrates are substantially orthogonal with respect to each other.
15. A solder structure according to claim 1 wherein the substrate comprises a microelectronic die.
16. A solder structure according to claim 1 wherein the solder wettable pad and the solder bump comprise different materials.
17. A solder structure according to claim 1 wherein the solder bump has a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length of the solder bump parallel to the edge of the substrate is greater than the width of the solder bump perpendicular to the edge of the substrate.
18. A solder structure according to claim 17 wherein the solder wettable pad is set back from the edge of the substrate wherein the substrate includes solder non-wettable portions that are exposed between the solder wettable pad and the edge of the substrate, and wherein a distance between the solder bump and the solder non-wettable portions of the substrate increases with increasing distance from the solder wettable pad toward the edge of the substrate.
19. A solder structure according to claim 1 , wherein the solder wettable pad and the solder bump comprise different materials, wherein the solder bump is directly on the solder wettable pad, and wherein a contact area between the solder bump and the solder wettable pad has a length parallel to the edge of the substrate that is greater than a width perpendicular to the edge of the substrate.
20. A solder structure according to claim 1 , wherein the solder wettable pad comprises a first solder wettable pad and wherein the solder bump comprises a first solder bump, the solder structure further comprising: a second solder wettable pad on the substrate adjacent the edge of the substrate, the second solder wettable pad having a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length parallel to the edge of the substrate is greater than the width perpendicular to the edge of the substrate, and wherein the first and second solder wettable pads are spaced apart; and a second solder bump on the second solder wettable pad wherein the second solder bump extends laterally from the second solder wettable pad toward the edge of the substrate at least to within 10 microns of the edge of the substrate, and wherein the first and second solder bumps are spaced apart.
21. A solder structure comprising: a substrate; a solder wettable pad on the substrate adjacent an edge of the substrate, the solder wettable pad having a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length parallel to the edge of the substrate is greater than the width perpendicular to the edge of the substrate, and wherein the solder wettable pad is set back from the edge of the substrate; and a solder bump on the solder wettable pad wherein the solder bump extends laterally from the solder wettable pad beyond the edge of the substrate.
22. A solder structure according to claim 21 further comprising: at least one solder wettable reservoir connected to the solder wettable pad, the solder wettable reservoir having a width at a connection with the solder wettable pad that is less than the width of the solder wettable pad.
23. A solder structure according to claim 21 further comprising: first and second solder wettable reservoirs connected to opposing ends of the solder wettable pad wherein the connections of the solder wettable reservoirs to the solder wettable pad are separated by the length of the solder wettable pad parallel to the edge of the substrate.
24. A solder structure according to claim 23 wherein portions of the first and second solder wettable reservoirs connected to the solder wettable pad have respective widths that are less than the width of the solder wettable pad.
25. A solder structure according to claim 21 further comprising: a second substrate adjacent the edge of the first substrate, wherein the first and second substrates are not parallel and wherein the solder bump is connected to the second substrate.
26. A solder structure according to claim 21 wherein the substrate comprises a microelectronic die.
27. A solder structure according to claim 21 wherein the solder bump has a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length of the solder bump parallel to the edge of the substrate is greater than the width of the solder bump perpendicular to the edge of the substrate.
28. A solder structure according to claim 27 wherein the solder wettable pad is set back from the edge of the substrate wherein the substrate includes solder non-wettable portions that are exposed between the solder wettable pad and the edge of the substrate, and wherein a distance between the solder bump and the solder non-wettable portions of the substrate increases with increasing distance from the solder wettable pad toward the edge of the substrate.
29. A solder structure according to claim 21 , wherein the solder wettable pad and the solder bump comprise different materials, wherein the solder bump is directly on the solder wettable pad, and wherein a contact area between the solder bump and the solder wettable pad has a length parallel to the edge of the substrate that is greater than a width perpendicular to the edge of the substrate.
30. A solder structure according to claim 21 , wherein the solder wettable pad comprises a first solder wettable pad and wherein the solder bump comprises a first solder bump, the solder structure further comprising: a second solder wettable pad on the substrate adjacent the edge of the substrate, the second solder wettable pad having a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length parallel to the edge of the substrate is greater than the width perpendicular to the edge of the substrate, wherein the second solder wettable pad is set back from the edge of the substrate, and wherein the first and second solder wettable pads are spaced apart; and a second solder bump on the second solder wettable pad wherein the second solder bump extends laterally from the second solder wettable pad beyond the edge of the substrate, and wherein the first and second solder bumps are spaced apart.
31. A solder structure comprising: a first substrate; a solder wettable pad on the first substrate adjacent an edge of the first substrate, the solder wettable pad having a length parallel to the edge of the first substrate and a width perpendicular to the edge of the first substrate wherein the length parallel to the edge of the first substrate is greater than the width perpendicular to the edge of the first substrate, and wherein the solder wettable pad is set back from the edge of the substrate; a solder bump on the solder wettable pad; and a second substrate adjacent the edge of the first substrate, wherein the first and second substrates are not parallel and wherein the solder bump is connected to the second substrate.
32. A solder structure according to claim 31 wherein the first and second substrates are substantially orthogonal with respect to each other.
33. A solder structure according to claim 31 the solder wettable pad is set back from the edge of the substrate by at least 20 microns and wherein the solder bump extends laterally from the solder wettable pad toward the edge of the substrate at least to within 10 microns of the edge of the first substrate.
34. A solder structure according to claim 31 wherein the first substrate comprises a microelectronic die.
35. A solder structure according to claim 31 wherein the solder wettable pad and the solder bump comprise different materials.
36. A solder structure according to claim 31 further comprising: a solder wettable reservoir connected to the solder wettable pad, the solder wettable reservoir having a width at a connection with the solder wettable pad that is less than the width of the solder wettable pad.
37. A solder structure according to claim 36 wherein the width of the solder wettable pad is at least 10% greater than a greatest width of the solder wettable reservoir.
38. A solder structure according to claim 31 wherein the solder bump has a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length of the solder bump parallel to the edge of the substrate is greater than the width of the solder bump perpendicular to the edge of the substrate.
39. A solder structure according to claim 38 wherein the solder wettable pad is set back from the edge of the substrate wherein the substrate includes solder non-wettable portions that are exposed between the solder wettable pad and the edge of the substrate, and wherein a distance between the solder bump and the solder non-wettable portions of the substrate increases with increasing distance from the solder wettable pad toward the edge of the substrate.
40. A solder structure according to claim 31 , wherein the solder wettable pad and the solder bump comprise different materials, wherein the solder bump is directly on the solder wettable pad, and wherein a contact area between the solder bump and the solder wettable pad has a length parallel to the edge of the substrate that is greater than a width perpendicular to the edge of the substrate.
41. A solder structure according to claim 31 , wherein the solder wettable pad comprises a first solder wettable pad and wherein the solder bump comprises a first solder bump, the solder structure further comprising: a second solder wettable pad on the second first substrate adjacent the edge of the first substrate, the second solder wettable pad having a length parallel to the edge of the first substrate and a width perpendicular to the edge of the first substrate wherein the length parallel to the edge of the first substrate is greater than the width perpendicular to the edge of the first substrate, and wherein the first and second solder wettable pads are spaced apart; and a second solder bump on the second solder wettable pad wherein the second solder bump is connected to the second substrate, and wherein the first and second solder bumps are spaced apart.
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February 27, 2006
February 9, 2010
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