Polymer-ceramic composite materials for use in the formation of capacitors, which materials exhibit very low changes in temperature coefficient of capacitance (TCC) in response to changes in temperature within the range of from about −55° C. to about 125° C. Specifically, these capacitor materials have a change in TCC ranging from about −5% to about +5%, in response to changes in temperature within the desired temperature range. The inventive composite materials comprise a blend of a polymer component and ferroelectric ceramic particles, wherein the polymer component includes at least one epoxy-containing polymer, and at least one polymer having epoxy-reactive groups. The inventive polymer-ceramic composite materials have excellent mechanical properties such as improved peel strength and lack of brittleness, electrical properties such as high dielectric constant, and improved processing characteristics.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A composite material which comprises a blend of a polymer component and ferroelectric ceramic particles, which polymer component comprises at least one epoxy containing polymer, in an amount of from about 5 wt. % to about 95 wt. % based on the weight of the polymer component, and at least one polymer having a plurality of epoxy-reactive groups in an amount of from about 5 wt. % to about 95wt. % based on the weight of the polymer component, wherein the composite material exhibits a change in temperature coefficient of capacitance of from about −5% to about +5%, responsive to a temperature change within the range of from about −55° C. to about 125° C.
2. The composite material of claim 1 wherein the epoxy containing polymer comprises a phenol novolak epoxy, an epoxy having an aliphatic or aromatic hydrocarbon backbone derived from bisphenol A or bisphenol F, a butadiene-acrylic modified epoxy, or combinations thereof.
3. The composite material of claim 1 wherein the polymer having a plurality of epoxy-reactive groups comprises a polyimide, a polyamideimide, a polyvinyl butyral, a polyethersulphone, a reactive polyester, or combinations thereof.
4. The composite material of claim 1 wherein the polymer having a plurality of epoxy-reactive groups comprises a polyester having a plurality of hydroxyl groups.
5. The composite material of claim 1 wherein the ferroelectric ceramic particles comprise barium titanate, strontium titanate, barium strontium titanate, or combinations thereof.
6. The composite material of claim 1 wherein the ferroelectric ceramic particles are present in the form of a powder.
7. The composite material of claim 1 which exhibits a change in temperature coefficient of capacitance of from about −2.5% to about +2.5%, responsive to a temperature change within the range of from about −55° C. to about 125° C.
8. The composite material of claim 1 which exhibits a change in temperature coefficient of capacitance of from about −0.5% to about +0.5%, responsive to a temperature change within the range of from about −55° C. to about 125° C.
9. The composite material of claim 1 which has a dielectric constant of from about 15 to about 30.
10. An article which comprises an electrically conductive layer, and a layer of the composite material of claim 1 on the electrically conductive layer.
11. A capacitor which comprises a first electrically conductive layer, a second electrically conductive layer and a layer of the composite material of claim 1 attached between the first electrically conductive layer and the second electrically conductive layer.
12. The capacitor of claim 11 wherein the first electrically conductive layer and the second electrically conductive layer independently comprise copper, aluminum, nickel, silver, iron nickel alloy, or combinations thereof.
13. The capacitor of claim 11 wherein the first electrically conductive layer and the second electrically conductive layer comprise copper.
14. A printed circuit board comprising the capacitor of claim 11 .
15. An electronic device comprising the printed circuit board of claim 14 .
16. An electronic device comprising the capacitor of claim 11 .
17. A capacitor which comprises: a) a first article which comprises a first electrically conductive layer, and a layer of the composite material of claim 1 on the first electrically conductive layer; and b) a second article which comprises a second electrically conductive layer, and a layer of the composite material of claim 1 on the second electrically conductive layer the first and second article being attached to each other such that their layers of the composite material are in contact with each other.
18. A composite material which comprises a blend of a polymer component and a ferroelectric ceramic powder, which polymer component comprises at least one epoxy containing polymer, in an amount of from about 5 wt. % to about 95 wt. % based on the weight of the polymer component, and at least one polymer having a plurality of epoxy-reactive groups in an amount of from about 5 wt. % to about 95wt. % based on the weight of the polymer component; wherein the ferroelectric ceramic powder comprises barium titanate, strontium titanate, barium strontium titanate, or combinations thereof; wherein the epoxy containing polymer comprises a phenol novolak epoxy, an epoxy having an aliphatic or aromatic hydrocarbon backbone derived from bisphenol A or bisphenol F, a butadiene-acrylic modified epoxy, or combinations thereof; wherein the polymer having a plurality of epoxy-reactive groups comprises a polyimide, a polyamideimide, a polyvinyl butyral, a polyethersulphone, a reactive polyester, or combinations thereof; and wherein the composite material exhibits a change in temperature coefficient of capacitance of from about −5% to about +5%, responsive to a temperature change within the range of from about −55° C. to about 125° C.
19. A method for forming a capacitor which comprises: a) providing a composite material which comprises a blend of a polymer component and ferroelectric ceramic particles, which polymer component comprises at least one epoxy containing polymer, in an amount of from about 5wt. % to about 95 wt. % based on the weight of the polymer component, and at least one polymer having a plurality of epoxy-reactive groups in an amount of from about 5 wt. % to about 95 wt. % based on the weight of the polymer component, wherein the composite material exhibits a change in temperature coefficient of capacitance of from about −5% to about +5%, responsive to a temperature change within the range of from about −55° C. to about 125° C.; and b) attaching a layer of the composite material between a first electrically conductive layer and a second electrically conductive layer.
20. The method of claim 19 wherein the attaching step (b) comprises: i) forming a first article comprising the first electrically conductive layer, and a layer of the composite material on the first electrically conductive layer; ii) forming a second article comprising the second electrically conductive layer, and a layer of the composite material on the second electrically conductive layer; and iii) joining the first article and second article together such that the composite material layer of the first article is in contact with the composite material layer of the second article.
21. The method of claim 20 wherein step iii) comprises laminating the first article and the second article together and/or curing the composite material layers.
22. The method of claim 19 wherein the attaching step (b) comprises: i) applying a layer of the composite material onto a first electrically conductive layer; and ii) applying a second electrically conductive layer onto a surface of the layer of composite material which is on the first electrically conductive layer; and iii) optionally laminating the first electrically conductive layer and the layer of composite material and the second electrically conductive layer together, and/or curing the layer of composite material.
23. The method of claim 19 wherein the attaching step (b) comprises: i) applying a layer of the composite material onto a first electrically conductive layer; then ii) curing the layer of composite material; and then iii) forming a second electrically conductive layer on a surface of the composite material which surface is opposite the first metal layer, via sputtering.
24. The method of claim 19 wherein the epoxy containing polymer comprises a phenol novolak epoxy, an epoxy having an aliphatic or aromatic hydrocarbon backbone derived from bisphenol A or bisphenol F, a butadiene-acrylic modified epoxy or combinations thereof.
25. The method of claim 19 wherein the ferroelectric ceramic particles comprise barium titanate, strontium titanate, barium strontium titanate, or combinations thereof.
26. The method of claim 19 wherein the polymer having a plurality of epoxy-reactive groups comprises a polyimide, a polyamideimide, a polyvinyl butyral, a polyethersulphone, a reactive polyester, or combinations thereof.
27. A method of forming a printed circuit board, which comprises incorporating a capacitor formed according to claim 19 into a printed circuit board.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 14, 2007
March 2, 2010
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.