The invention provides a semiconductor device, a method of manufacturing the same, an electro-optic device and an electronic apparatus which are capable of addressing or solving a problem of mechanical mounting of a semiconductor element chip on a substrate. A semiconductor device includes a tile-shaped microelement bonded to a substrate, and an insulating functional film provided to cover at least a portion of the tile-shaped microelement.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a semiconductor device, comprising: forming a sacrificial layer on a substrate; forming a functional layer on the sacrificial layer; forming a semiconductor element including at least a part of the functional layer; forming a tile-shaped microelement by separating the semiconductor element from the substrate by etching the sacrificial layer; bonding the tile-shaped element to another substrate; forming an insulating protective film so as to cover at least a portion of the tile-shaped microelement; and electrically connecting the semiconductor element to a circuit previously formed.
2. The method of manufacturing the semiconductor device according to claim 1 , further including forming the functional film by at least one of a droplet discharge process and a dispenser process.
3. An electro-optic device, comprising: a semiconductor device manufactured by the method of claim 1 .
4. A method of manufacturing a semiconductor device, comprising: forming a sacrificial layer on a substrate; forming a functional layer on the sacrificial layer; forming a semiconductor element including at least a part of the functional layer; etching the sacrificial layer to separate the semiconductor element from the substrate and form a tile-shaped microelement; bonding the tile-shaped microelement to another substrate; electrically connecting the tile-shaped microelement to a circuit previously formed; and forming an insulating protective film having a barrier property against oxygen and moisture so as to cover at least a portion of the tile-shaped microelement.
5. A method of manufacturing a semiconductor device that comprises a substrate; a tile-shaped microelement bonded to the substrate; and an insulating protective film having a barrier property against oxygen and moisture, the insulating protective film provided to cover at least a portion of the tile-shaped microelement, in which the functional film covers the tile-shaped microelement in a sealed state, the method comprising: forming a sacrificial layer on a substrate; forming a functional layer on the sacrificial layer; forming a semiconductor element including at least a part of the functional layer; forming a tile-shaped microelement by separating the semiconductor element from the substrate by etching the sacrificial layer; bonding the tile-shaped element to another substrate; forming an insulating protective film so as to cover at least a portion of the tile-shaped microelement; and electrically connecting the semiconductor element to a circuit previously formed.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 12, 2007
May 4, 2010
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