A method of manufacturing a display device to improve the quality of a polycrystal silicon upon dehydrogenating and polycrystallizing an amorphous silicon at the outside of a display region of a substrate, by forming a plurality of pixels having TFT devices using an amorphous silicon in the display region of the substrate, and forming a plurality of driving circuits having semiconductor devices using a polycrystal silicon at the outside of the display region, the method including irradiation of a first continuous oscillation laser only to the amorphous silicon in the region for forming the driving circuit and the peripheral region thereof to conduct dehydrogenation and then irradiation of a second continuous oscillation region only to the dehydrogenated region to polycrystallize the amorphous silicon, wherein the region to which the first continuous oscillation laser is irradiated is wider than the region to which the second continuous oscillation laser is irradiated.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a display device, the method comprising; a first step of depositing a hydrogenated amorphous silicon on a substrate and a second step of dehydrogenating a predetermined region of the hydrogenated amorphous silicon and then melting and crystallizing the amorphous silicon in a dehydrogenated region into polycrystal silicon, a step of forming a plurality of pixels having TFT devices using an amorphous silicon in a display region of the substrate, and forming a driving circuit having a plurality of semiconductor devices using the polycrystal silicon to the outside of the display region, wherein in the second step, a first continuous oscillation laser is irradiated only to the region of forming the driving circuit and the peripheral region thereof at the outside of the display region of the substrate to conduct dehydrogenation, and a second continuous oscillation laser is irradiated only to the dehydrogenated region to transform the amorphous silicon into the polycrystal silicon; and the region to which the first continuous oscillation laser is irradiated is wider than the region to which the second continuous oscillation laser is irradiated.
2. The method of manufacturing a display device according to claim 1 , wherein the first continuous oscillation laser and the second continuous oscillation laser are irradiated while scanning over the substrate; the energy density of the first continuous oscillation laser is lower than the energy density of the second continuous oscillation laser; and the time for the irradiation of the first continuous oscillation laser is longer than the time for the irradiation of the second continuous oscillation laser on each of the points in the region for the irradiation of the first continuous oscillation laser and the second continuous oscillation laser.
3. The method of manufacturing a display device according to claim 2 , wherein the beam width of the first continuous oscillation laser in the scanning direction is wider than the beam width of the second continuous oscillation laser in the scanning direction.
4. The method of manufacturing a display device according to claim 2 , wherein the scanning speed of the first continuous oscillation laser is different from the scanning speed of the second continuous oscillation laser.
5. The method of manufacturing a display device according to claim 4 , wherein the scanning speed of the first continuous oscillation laser is lower than the scanning speed of the second continuous oscillation laser.
6. The method of manufacturing a display device according to claim 1 , wherein in the second step, irradiation is performed with the first continuous oscillation laser and the second continuous oscillation laser during scanning of a strip-like region on the substrate in a first direction.
7. The method of manufacturing a display device according to claim 6 , wherein in the second step, scanning is performed on a strip-like region on the substrate in the first direction and then scanning is performed on a strip-like region different from said strip-like region on the substrate in a direction opposite to the first direction.
8. The method of manufacturing a display device according to claim 1 , wherein in the second step, a third continuous oscillation laser is irradiated to a region formed into polycrystal silicon by the irradiation of the second continuous oscillation laser.
9. The method of manufacturing a display device according to claim 8 , wherein in the second step, the first continuous oscillation laser, the second continuous oscillation laser, and the third continuous oscillation laser are irradiated during scanning of a strip-like region on the substrate in the first direction.
10. The method of manufacturing a display device according to claim 8 , wherein in the second step, scanning is performed on a strip-like region of the substrate in the first direction, then scanning is performed on a strip-like region different from said strip-like region in the direction opposite to the first direction; and when scanning the different stripe-like region, the third continuous oscillation laser is irradiated to dehydrogenate the hydrogenated amorphous silicon film; the second continuous oscillation laser is irradiated to the amorphous silicon dehydrogenated by the third continuous oscillation laser into polycrystal silicon; and the first continuous oscillation laser is irradiated to the region formed into the polycrystal silicon by the irradiation of the second continuous oscillation laser.
11. The method of manufacturing a display device according to claim 10 , wherein the focal point of the first continuous oscillation laser and the focal point of the third continuous oscillation laser are switched to each other between the scanning in the first direction and the scanning in the direction opposite to the first direction on the substrate.
12. A method of manufacturing a liquid crystal display device having a liquid crystal display panel in which liquid crystals are put between a substrate and an opposed substrate, the method including; a first step of depositing a hydrogenated amorphous silicon film on the substrate, and a second step of dehydrogenating a predetermined region of the hydrogenated amorphous silicon film and then melting and crystallizing the amorphous silicon in the dehydrogenated region into a polycrystal silicon, a step of forming a plurality of pixels having TFT devices using the amorphous silicon in a display region of the substrate and forming a driving circuit having a plurality of semiconductor devices using the polycrystal silicon to the outside of the display region, wherein in the second step, a first continuous oscillation laser is irradiated only to the region for forming the driving circuit and the peripheral region thereof at the outside of the display region of the substrate to conduct dehydrogenation, and a second continuous oscillation laser is irradiated only to the dehydrogenated region to form the amorphous silicon into the polycrystal silicon, and the region to which the first continuous oscillation laser is irradiated is wider than the region to which the second continuous oscillation laser is irradiated.
13. The method of manufacturing a liquid crystal display device according to claim 12 , wherein the first continuous oscillation laser and the second continuous oscillation laser are irradiated while scanning over the substrate; the energy density of the first continuous oscillation laser is lower than the energy density of the second continuous oscillation laser; and the time for the irradiation of the first continuous oscillation laser is longer than the time for the irradiation of the second continuous oscillation laser on each of points in the region irradiated by the first continuous oscillation laser and the second continuous oscillation laser.
14. The method of manufacturing a liquid crystal display device according to claim 13 , wherein the beam width of the first continuous oscillation laser in the scanning direction is wider than the beam width of the second continuous oscillation laser in the scanning direction.
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August 6, 2007
June 8, 2010
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