A heat extractor to transfer heat generated by the coil of a magnetic read head to a substrate, when there is at least one thermally insulating layer between the coil and the substrate, is disclosed, together with a method for its manufacture.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method to conduct heat generated by a coil located within a structure, to a single substrate, wherein there is at least one thermally insulating layer between said coil and said substrate, comprising: forming a thermally conductive pedestal that originates at said substrate, and extends upwards therefrom; forming a layer of thermally conductive material that overlies said coil and extends beyond said coil to overlie said pedestal; and thermally connecting said coil to said substrate through said pedestal, thereby providing an unbroken thermal path between said coil and said substrate.
2. The method of claim 1 wherein said layer of thermally conductive material and said conductive pedestal have a thermal conductivity between 100 and 400 W/m.K.
3. The method of claim 1 wherein said layer of thermally conductive material is selected from the group consisting of copper, tungsten, molybdenum, silicon, ruthenium, rhodium, and iridium.
4. The method of claim 1 wherein said layer of thermally conductive material has a thickness between 1 and 2.5 microns.
5. The method of claim 1 wherein said pedestal has a cross-sectional area that is between 10,000 and 15,000 sq. microns.
6. The method of claim 1 wherein said coil generates heat at a rate between 4 and 15 milliwatts.
7. A heat extractor for a structure that includes a coil, a single substrate, and at least one thermally insulating layer between said coil and said substrate, comprising: a thermally conductive pedestal that originates at said substrate and extends upwards therefrom; a layer of thermally conductive material that that overlies said coil and extends beyond said coil to overlie said pedestal; and a thermal connection between said pedestal and said coil, whereby there is an unbroken thermal path between said coil and said substrate.
8. The heat extractor described in claim 7 wherein said layer of thermally conductive material and said conductive pedestal have a thermal conductivity between 100 and 400 W/m.K.
9. The heat extractor described in claim 7 wherein said layer of thermally conductive material is selected from the group consisting of copper, tungsten, molybdenum, silicon, ruthenium, rhodium, and iridium.
10. The heat extractor described in claim 7 wherein said layer of thermally conductive material has a thickness between 1 and 2.5 microns.
11. The heat extractor described in claim 7 wherein said pedestal has a cross-sectional area that is between 10,000 and 15,000 sq. microns.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 13, 2004
July 6, 2010
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