A method and device relating the electrical interconnection of angularly disposed conductive is disclosed. Conventional wire bonding equipment is used to apply a wire ball on a first conductive surface in an electronic assembly. A conductive wire is drawn up vertically and terminated such that the central portion of the wire is proximal the second conductive surface. The electronic assembly is reoriented with respect to the travel of the capillary whereby a stitch bond is defined upon the second conductive surface to define an interconnect wire and a terminal wire portion, which terminal wire portion is removed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for electrically connecting angularly disposed conductive surfaces, the method comprising: providing a first conductive surface angularly disposed to a second conductive surface, wherein the first conductive surface is located on an electronic module and the second conductive surface is located on a substrate, and wherein the electronic module is bonded to the substrate; providing a conductive wire having a first wire end, a second wire end, and a central wire portion between the first and second wire ends; electrically connecting the first wire end to the first conductive surface using a wire ball bond; positioning the central wire portion proximate the second conductive surface; and electrically connecting the central wire portion to the second conductive surface using a stitch bond to define an interconnect wire and a terminal wire portion.
2. The method of claim 1 , further comprising removing at least a portion of the terminal wire portion.
3. The method of claim 1 , wherein the wire comprises at least one of gold or a gold-palladium alloy.
4. The method of claim 1 , wherein the wire comprises at least one of aluminum, copper, or tungsten.
5. The method of claim 1 , wherein the electronic module comprises multiple layers and is mounted on a printed circuit board.
6. The method of claim 1 , wherein the first conductive surface is positioned substantially perpendicular to the second conductive surface.
7. The method of claim 1 , further comprising disposing the first and second conductive surfaces at an angle of about 10 degrees prior to said electrically connecting the first wire end to the first conductive surface.
8. The method of claim 1 , further comprising drawing the conductive wire along a lateral surface of the electronic module.
9. The method of claim 1 , wherein the electronic module comprises at least one of a bare integrated circuit die, a neo-layer, a modified pre-packaged integrated circuit die, or a pre-packaged integrated circuit die.
10. An electronic assembly having at least two angularly disposed conductive surfaces, the electronic assembly comprising: a first conductive surface angularly disposed to a second conductive surface, wherein the first conductive surface is located on an electronic module and the second conductive surface is located on a substrate, and wherein the electronic module is bonded to the substrate; and a conductive wire having a first wire end, a second wire end and a central wire portion therebetween, wherein the first wire end is electrically connected to the first conductive surface by a wire ball bond, and wherein the central wire portion is electrically connected to the second conductive surface by a stitch bond to define an interconnect wire.
11. The electronic assembly of claim 10 , wherein the wire comprises at least one of gold or a gold-palladium alloy.
12. The electronic assembly of claim 10 , wherein the wire comprises at least one of aluminum, copper, or tungsten.
13. The electronic assembly of claim 10 , wherein the electronic module comprises multiple layers and is mounted on a printed circuit board.
14. The electronic assembly of claim 10 , wherein the first conductive surface is positioned substantially perpendicular to the second conductive surface.
15. The electronic assembly of claim 10 , wherein at least one of the first or second conductive surfaces is located on a lateral surface of a multi-layer electronic module.
16. The electronic assembly of claim 15 , wherein the electronic module comprises at least one bare integrated circuit die.
17. The electronic assembly of claim 15 , wherein the electronic module comprises at least one neo-layer.
18. The electronic assembly of claim 15 , wherein the electronic module comprises at least one modified pre-packaged integrated circuit die.
19. The electronic assembly of claim 15 , wherein the electronic module comprises at least one commercial off-the-shelf prepackaged integrated circuit die.
20. A method comprising: electrically connecting a first end of a wire to a first conductive surface of a first electronic apparatus using a wire ball bond; positioning at least a central portion of the wire proximate a second conductive surface of a second electronic apparatus, wherein the second conductive surface is angularly positioned with respect to the first conductive surface; and electrically connecting the wire to the second conductive surface of the second electronic apparatus using a stitch bond.
21. The method of claim 20 , further comprising removing at least a portion of a terminal wire portion extending beyond the stitch bond.
22. The method of claim 20 , wherein at least one of the first or second electronic apparatuses comprises multiple layers and is mounted on a printed circuit board.
23. The method of claim 20 , wherein the first conductive surface is positioned substantially perpendicular to the second conductive surface.
24. The method of claim 20 , further comprising tilting the first and second apparatuses prior to said electrically connecting a first end of a wire to a first conductive surface.
25. The method of claim 20 , further comprising drawing the conductive wire along a lateral surface of at least one of the first or second electronic apparatuses.
26. An electronic assembly comprising: a first electronic module having a first conductive surface; a second electronic module having a second conductive surface, wherein the second conductive surface is provided at an angle with respect to the first conductive surface; and a wire configured to electrically connect the first conductive surface and the second conductive surface, wherein the wire includes a first end electrically connected to the first conductive surface by a wire ball bond, a second end electrically connected to the second conductive surface by a stitch bond, and a central portion positioned proximate the second conductive surface.
27. The electronic assembly of claim 26 , wherein at least one of the first or second electronic modules comprises multiple layers and is mounted on a printed circuit board.
28. The electronic assembly of claim 26 , wherein the first conductive surface is substantially perpendicular to the second conductive surface.
29. The electronic assembly of claim 26 , wherein the wire comprises at least one of gold or a gold-palladium alloy.
30. The electronic assembly of claim 26 , wherein at least one of the first or second electronic modules comprises at least one of a bare integrated circuit die, a neo-layer, a modified pre-packaged integrated circuit die, or a pre-packaged integrated circuit die.
31. A method comprising: electrically connecting a first end of a wire to a first conductive surface of a first electronic apparatus using a wire ball bond; positioning at least a central portion of the wire proximate a second conductive surface of a second electronic apparatus, wherein the second conductive surface is angularly positioned with respect to the first conductive surface, and wherein the second electronic apparatus is a substrate bonded to the first electronic apparatus; and electrically connecting the wire to the second conductive surface of the second electronic apparatus using a stitch bond.
32. The method of claim 31 , wherein the first conductive surface is substantially perpendicular to the second conductive surface.
33. The method of claim 31 , further comprising tilting the first and second conductive surfaces prior to said electrically connecting a first end of a wire to a first conductive surface.
34. The method of claim 31 , further comprising drawing the conductive wire along a lateral surface of at least one of the first or second electronic apparatuses.
35. The method of claim 31 , further comprising removing at least a portion of the wire extending beyond the stitch bond.
36. An electronic assembly comprising: a first electronic apparatus having a first conductive surface; a second electronic apparatus having a second conductive surface, wherein the second conductive surface is angularly positioned with respect to the first conductive surface, and wherein the second electronic apparatus is a substrate bonded to the first electronic apparatus; and a wire configured to electrically connect the first conductive surface and the second conductive surface, wherein the wire includes a first end electrically connected to the first conductive surface by a wire ball bond, a second end electrically connected to the second conductive surface by a stitch bond, and a central portion located between the first and second ends and positioned proximate the second conductive surface.
37. The electronic assembly of claim 36 , wherein the first electronic apparatus has multiple layers.
38. The electronic assembly of claim 36 , wherein the first conductive surface is substantially perpendicular to the second conductive surface.
39. The electronic assembly of claim 36 , wherein the wire comprises at least one of gold or a gold-palladium alloy.
40. The electronic assembly of claim 36 , wherein the first apparatus comprises at least one of a bare integrated circuit die, a neo-layer, a modified pre-packaged integrated circuit die, or a pre-packaged integrated circuit die.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 24, 2007
August 10, 2010
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