An ink jet nozzle assembly is provided having a wafer substrate defining an ink supply passage, a drive circuitry layer formed on the wafer substrate, an ink chamber structure on the drive circuitry layer, the ink chamber structure defining an ink chamber in fluid communication with the ink supply passage and an ink ejection port, and a layered actuator having a first layer electrically coupled to the drive circuitry layer so that the drive circuitry layer can electrically actuate the actuator to thereby eject ink from the ink ejection port.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An ink jet nozzle assembly comprising: a wafer substrate defining an ink supply passage; a drive circuitry layer formed on the wafer substrate; an ink chamber structure on the drive circuitry layer, the ink chamber structure defining an ink chamber in fluid communication with the ink supply passage and an ink ejection port; an ejection member disposed between the ink supply passage and the ink ejection port; and a layered actuator having a first layer electrically coupled to the drive circuitry layer and the ejection member so that the drive circuitry layer can electrically actuate the actuator to move the ejection member and thereby eject ink from the ink ejection port.
2. An ink jet nozzle assembly as claimed in claim 1 , wherein the first layer of the actuator comprises titanium nitride or copper nickel alloy material.
3. An ink jet nozzle assembly as claimed in claim 1 , wherein a second layer of the actuator comprises one of glass, amorphous silicon dioxide and any other like thermal insulating material.
4. An ink jet nozzle assembly as claimed in claim 1 , wherein the ink chamber structure comprises a cylindrical wall and a cover that defines the ink ejection port.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 11, 2009
August 24, 2010
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