One embodiment pertains to a method for reviewing a potential defect on a substrate from one electron image. An image of an area containing the potential defect is obtained using a charged-particle apparatus. At least three image segments within the image are determined. The three segments are transformably identical to each other, and one of said three segments includes the potential defect. Another embodiment pertains to a method for reviewing a potential defect on a substrate by obtaining an electron-beam image of a relatively large field of view containing a first image segment. The first image segment is substantially smaller than the field of view and includes a location of the potential defect. A comparison image segment within the field of view is determined. The comparison image segment is transformably identical to the first image segment. Other embodiments and features are also disclosed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An apparatus for analyzing a potential defect on a substrate, the apparatus comprising: processor-executable code configured to determine a margin of error for a previous defect detection; an electron beam configuration, with a field of view that is at least ten times larger than the margin of error, for obtaining an image of an area containing the potential defect; processor-executable code configured to determine a first segment within the image, wherein the first segment includes the potential defect; and processor-executable code configured to determine, using CAD layout data, at least two comparison segments within the image, wherein the comparison segments are transformably identical to the first segment.
2. The apparatus of claim 1 , further comprising processor-executable code configured to perform transformations to align image data of the comparison segments to the first segment.
3. The apparatus of claim 2 , further comprising processor-executable code configured to generate difference images between the comparison segments and the first segment.
4. The apparatus of claim 3 , further comprising processor-executable code configured to verify the potential defect using the difference images.
5. The apparatus of claim 4 , further comprising processor-executable code configured to localize and classify a verified defect using the difference images.
6. A computer-implemented method for reviewing a potential defect on a substrate using an electron beam apparatus, the method comprising: determining a margin of error for a previous defect detection; obtaining an electron-beam image of a field of view containing a first image segment, wherein the field of view is at least ten times larger than the margin of error, the first image segment is substantially smaller than the field of view and the first image includes a location of the potential defect; determining a comparison image segment within the field of view using CAD layout data, wherein the comparison image segment is transformably identical to the first image segment.
7. The method of claim 6 , further comprising: performing transformations to align image data of the comparison image segment to the first image segment.
8. The method of claim 6 , further comprising generating a difference image between the comparison image segment and the first image segment.
9. The method of claim 8 , further comprising verification of the potential defect using the difference image.
10. The method of claim 6 , wherein the first image segment is in a center region of the field of view.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 22, 2010
September 7, 2010
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