A cable connection with at least one cable as a wire conducted signal interconnection between two cables module circuits connected to respective ends of the cable connection. Conductors of the cable may be directly and permanent electrical connected at each end to the respective contacts at the respective cable module circuit. The cable module circuits may be arranged for sending and/or receiving of a wire-conducted signal transmitted via the cable connection. During fabrication of the integrated cable module the cable module circuits can be matched to the respective cable impedance with high accuracy. Further, by connecting the cable permanent and directly to transceiver circuits at each end of the cable, the connection may be protected from different kinds of disturbances, enabling high simultaneous bidirectional bit rates using such interconnections between electronic units or modules.
Legal claims defining the scope of protection, as filed with the USPTO.
1. Apparatus comprising: at least one cable comprising a wire conducted signal interconnection between two cable module circuits connected to cable conductors at the opposite ends of the cable; wherein one or more signal wires of the cable conductors are directly and permanently electrically connected to each end of the cable with contacts of the respective cable module circuit, and wherein the cable module circuits are configured for simultaneous bidirectional signaling via the apparatus; wherein each of the cable module circuits is adapted to an impedance and length of the cable by matching input and output impedances of the cable module circuits to the respective cable impedance.
2. The apparatus according to claim 1 , wherein the cable comprises a shielded pair of cables configured for simultaneous bidirectional differential signaling.
3. The apparatus according to claim 1 , wherein the cable comprises a pair of coaxial cables configured for simultaneous bidirectional differential signaling.
4. The apparatus according to claim 1 , wherein each of the cable module circuits comprises transceiver units configured to send and receive a wire-conducted signal via the apparatus.
5. The apparatus according to claim 1 , wherein the cable comprises an outer conductor, said outer conductor connected to a ground potential of at least one of the cable module circuits.
6. The apparatus according to claim 1 , wherein the cable comprises an outer conductor having a thickness adapted to attenuate electronic discharge pulses and provide electronic discharge protection at the cable module circuits.
7. The apparatus according to claim 1 , wherein each of the cable module circuits comprises a multi-gigabit bidirectional transceiver.
8. Apparatus comprising: at least one cable comprising a wire conducted signal interconnection between two cable module circuits connected to cable conductors at the opposite ends of the cable; wherein one or more signal wires of the cable conductors are directly and permanently electrically connected to each end of the cable with contacts of the respective cable module circuit, and wherein the cable module circuits are configured for simultaneous bidirectional signaling via the apparatus; wherein the cable module circuits are integrated cable module circuits, and wherein the cable contact for at least one of the integrated cable module circuits is a direct bump on at least one of a contact pad, a repassivation or redistribution pad, and a thick repassivation or redistribution pad.
9. The apparatus according to claim 8 , wherein the at least one cable is fixed to a support board, and wherein the one or more signal wires of the cable conductors are directly and permanently connected to the support board and to the cable contact of at least one of the integrated cable module circuits by means of a bonding wire.
10. The apparatus according to claim 8 , wherein at least one of the cable module circuits is packed into a molded circuit package, the molded circuit package comprising connection means for permanently mounting the packed cable module circuit to a circuit board, the connection means comprising at least one of a connection pin, a connection bump, and a connection ball, and wherein at least one of the signal wires is directly and permanently connected to one of the cable module circuits via a printed wiring board having electrical connections to the contacts of the cable module circuit.
11. The apparatus according to claim 10 , wherein at least one of the integrated cable module circuits is interconnected in a flip chip arrangement.
12. The apparatus according to claim 10 , wherein at least one of the integrated cable module circuits is interconnected to a lead frame with lead frame contact pads, and wherein at least one of the signal wires of the cable conductors is connected to one of the lead frame contact pads.
13. An integrated circuit comprising: contacts for interconnection of the integrated circuit, wherein the integrated circuit is a cable module circuit arranged for simultaneous bidirectional signaling via a cable connection; wherein the cable module circuit is directly and permanently electrically connected to signal wires of one or more cable conductors, and wherein the cable module circuit is configured to connect to one end of a cable via the one or more cable conductors and configured to form a wire-conducted signal interconnection with another cable module circuit, the other cable module circuit being connected to one or more different cable conductors at the other end of the cable wherein the cable module circuit comprises an electronic discharge protection circuit configured to attenuate electronic discharge pulses, and wherein the configuration of the electronic discharge protection circuit is based on a predetermined thickness of an outer conductor of the cable.
14. The integrated circuit according to claim 13 , wherein the cable module circuit comprises transceiver units configured to send and receive a wire-conducted signal via the cable.
15. The integrated circuit according to claim 13 , wherein the cable module circuit is adapted to a predetermined cable impedance and a predetermined cable length.
16. The integrated circuit according to claim 13 , wherein at least one of the contacts of the cable module circuit is a direct bump on of at least one of a contact pad, a repassivation or redistribution pad, and a thick repassivation or redistribution pad.
17. The integrated circuit according to claim 13 , wherein the cable module circuit is arranged to be interconnected in a flip chip arrangement.
18. The integrated circuit according to claim 13 , wherein the cable module circuit is interconnected to a lead frame with lead frame contact pads, and wherein at least one signal wire of the cable conductors is connected to one of the lead frame contact pads.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 17, 2007
September 28, 2010
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.