A method of forming a reinforced slider body for use in a recording head having a transducer that is bi-directionally movable with respect to a surface of a magnetic medium. The method includes the steps of defining in a surface of a wafer a plurality of dice lanes having side walls to delineate a plurality of slider bodies on the wafer where the side walls having an angled configuration with respect to the wafer surface, polishing the dice lanes such that the interface between the wafer surface and the side walls is rounded, implanting a substance into the dice lanes; and applying a diamond-like carbon coating to the bottom surface and side walls of the dice lanes.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of forming a reinforced slider body for use in a recording head having a transducer that is bi-directionally movable with respect to a surface of a magnetic medium, the method comprising: defining in a surface of a wafer a plurality of dice lanes having side walls to delineate a plurality of slider bodies on the wafer, the side walls having an angled configuration with respect to the wafer surface; polishing the dice lanes such that the interface between the wafer surface and the side walls is rounded; implanting a substance into the dice lanes; applying a diamond-like carbon coating to the bottom surface and side walls of the dice lanes; forming a cavity portion in the wafer surface of the slider bodies; attaching a first segment having a plurality of toroidal coils to a second segment having a plurality of flexure beams to form a second wafer assembly; attaching the second wafer assembly to a slider body such that a cavity portion of the second segment cooperates with a cavity portion in the slider body to form a transducer cavity; vacuum attaching the slider body to a reference flat surface; and positioning a transducer body having a transducer in the transducer cavity using a touch sensor.
2. A method of forming a reinforced slider body as defined in claim 1 , further comprising: defining a plurality of air bearing surfaces on each slider body.
3. A method of forming a reinforced slider body as defined in claim 1 , wherein the wafer is composed substantially of silicon.
4. A method of forming a reinforced slider body as defined in claim 1 , wherein implanting a substance further comprises: implanting carbon into the dice lanes to a depth in the range of approximately one to five microns.
5. A method of forming a reinforced slider body as defined in claim 1 , wherein a slider body is formed having corners that retard crack production when the slider body contacts a magnetic medium surface.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 5, 2008
December 14, 2010
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