A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting the external leadfinger and the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A mountable integrated circuit package system comprising: providing a substrate having a through opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting a shoulder of the external leadfinger and the substrate.
2. The system as claimed in claim 1 wherein mounting the encapsulated integrated circuit package includes connecting an outer tip of the external leadfinger and the substrate.
3. The system as claimed in claim 1 further comprising forming an outer encapsulation over the encapsulated integrated circuit package.
4. The system as claimed in claim 1 further comprising forming an outer encapsulation over the encapsulated integrated circuit package, partially exposing the external leadfinger from the outer encapsulation.
5. A mountable integrated circuit package system comprising: providing a substrate having a through opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; connecting the external leadfinger and the substrate; forming an external interconnect under the substrate; and connecting a first stacking integrated circuit device mounted over the encapsulated integrated circuit package, and the external leadfinger.
6. The system as claimed in claim 5 further comprising connecting a first stacking integrated circuit device, mounted over the encapsulated integrated circuit package, and the substrate.
7. The system as claimed in claim 5 further comprising connecting a first stacking integrated circuit device, mounted under the encapsulated integrated circuit package, and the substrate.
8. The system as claimed in claim 5 further comprising: forming an outer encapsulation over the encapsulated integrated circuit package, partially exposing the outer tip from the outer encapsulation; and connecting a second stacking integrated circuit device to the outer tip over the outer encapsulation.
9. A mountable integrated circuit package system comprising: a substrate having a through opening provided therein; an encapsulated integrated circuit package having an external leadfinger, mounted by the external leadfinger proximate to the opening; and an intraconnect connected between a shoulder of the external leadfinger, that is over the substrate, and the substrate.
10. The system as claimed in claim 9 wherein an outer tip of the external leadfinger is connected over the substrate.
11. The system as claimed in claim 9 further comprising an outer encapsulation over the encapsulated integrated circuit package.
12. The system as claimed in claim 9 further comprising an outer encapsulation formed over the encapsulated integrated circuit package, partially exposing the external leadfinger from the outer encapsulation.
13. The system as claimed in claim 9 further comprising a first external interconnect formed under the substrate.
14. The system as claimed in claim 13 further comprising a first stacking integrated circuit device mounted over the encapsulated integrated circuit package and connected to the external leadfinger.
15. The system as claimed in claim 13 further comprising a first stacking integrated circuit device mounted over the encapsulated integrated circuit package and connected to the substrate.
16. The system as claimed in claim 13 further comprising a first stacking integrated circuit device, mounted under the encapsulated integrated circuit package, and connected to the substrate.
17. The system as claimed in claim 13 further comprising: an outer encapsulation formed over the encapsulated integrated circuit package with the outer tip leadfinger partially exposed from the outer encapsulation; and a second stacking integrated circuit device connected to the leadfinger over the outer encapsulation.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 25, 2008
December 21, 2010
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