Leadframe for a semiconductor package and manufacturing from such leadframe including a plurality of connection leads supported in a frame. Die mounting plate is centrally located in the leadframe and is supported by a plurality of support leads which are electrically connected to the die mounting pad and extending in a direction outwardly therefrom towards the frame. Each support lead is formed with a connection pad portion and a down set link portion. Each connection pad portion is spaced from the die mounting plate and is connected to a conductive bonding ground wire from a semiconductor device mounted on the die mounting plate. Each down set link portion is electrically connected to the die mounting pad and supports the die mounting pad in a spaced arrangement from the connection leads. The connection pad portion and the down set link portion overlap, in the direction of extension of the support lead.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A leadframe for a semiconductor package, the leadframe comprising: a connection lead supporting frame; a die mounting plate located inside the frame; a plurality of connection leads extending inwardly from the frame and terminating adjacent the die mounting plate but separated therefrom; and at least one support lead electrically connected to the die mounting plate and extending in a direction outwardly therefrom towards the frame; wherein the support lead comprises a connection pad portion, a bridge portion, and a down set link portion, wherein the connection pad portion is coupled to the down set link portion through the bridge portion, wherein the connection pad portion and down set link portion are oriented along a direction of extension of the support lead and disposed side-by-side to each other, wherein the bridge portion is oriented perpendicular to the direction of extension of the support lead, wherein the down set link portion extends beyond the connection pad portion and the bridge portion to connect to the die mounting plate.
2. The leadframe according to claim 1 , wherein the connection leads lie in a plane and the down set link portion of the support lead is angled away from the plane and the die mounting plate is supported by the support lead spaced apart form the plane.
3. The leadframe according to claim 1 , wherein the connection pad portion is spaced from the die mounting plate.
4. The leadframe according to claim 1 , wherein the at least one support lead comprises a plurality of support leads.
5. The leadframe according to claim 1 , wherein the connection pad portion comprises a wire bonding connection pad.
6. The leadframe according to claim 1 , wherein the support lead branches to form a first branch portion forming the connection pad portion spaced from the die mounting plate and a second branch portion forming the down set link portion connected to the die mounting plate.
7. The leadframe according to claim 6 , wherein the first branch portion and the second branch portion are arranged side by side in the direction of extension of the support lead, thereby overlapping in the direction of extension of the support lead.
8. The leadframe according to claim 7 , wherein the support lead branches to form a third branch portion for forming a lead portion that extends outwardly towards the frame.
9. The leadframe according to claim 1 , wherein the at least one support lead comprises a bridge portion extending laterally to the direction of extension for connecting the down set link portion, which down set link portion is connected to the die mounting plate, to at least one connection pad portion, with each connection pad portion spaced from the die mounting plate.
10. The leadframe according to claim 9 , wherein the down set link portion is connected to at least one lead portion, with each lead portion extending outwardly towards the frame.
11. The leadframe according to claim 1 , wherein the lead frame is one of a plurality of identical leadframes in a leadframe strip, the plurality of leadframes being attached end to end.
12. The leadframe according to claim 1 , wherein the lead frame is one of a plurality of identical leadframes in a leadframe matrix, the leadframes being attached to each other in a matrix formation.
13. A semiconductor package comprising: a leadframe comprising: a connection lead supporting frame; a die mounting plate located inside the frame; a plurality of connection leads extending inwardly from the frame and terminating adjacent the die mounting plate but separated therefrom; and at least one support lead electrically connected to the die mounting plate and extending in a direction outwardly therefrom towards the frame; wherein the support lead comprises a connection pad portion, a bridge portion, and a down set link portion, wherein the connection pad portion is coupled to the down set link portion through the bridge portion, wherein the connection pad portion and down set link portion are oriented along a direction of extension of the support lead and disposed side-by-side to each other, wherein the bridge portion is oriented perpendicular to the direction of extension of the support lead, wherein the down set link portion extends beyond the connection pad portion to connect to the die mounting plate; and a semiconductor die attached to the leadframe.
14. A semiconductor package, comprising: a package body; a semiconductor device; a die mounting plate to which is fixed the semiconductor device, both mounted within the package body; a plurality of metal leads having inner ends embedded within the package body and terminating adjacent the die mounting plate but separated therefrom and outer ends extending out of the package body; a support lead having an inner end embedded within the package body and electrically connected to the die mounting plate and extending in a direction outwardly therefrom; and a plurality of bonding wires for electrically connecting the semiconductor device to the metal leads and the support lead; wherein the support lead includes a connection pad portion, abridge portion, and a down set link portion, wherein the connection pad portion is connected to the down set link portion through the bridge portion, wherein the connection pad portion and down set link portion are oriented along a direction of extension of the support lead and disposed side-by-side to each other, wherein the bridge portion is oriented perpendicular to the direction of extension of the support lead, wherein the down set link portion extends beyond the connection pad portion to connect to the die mounting plate.
15. The semiconductor package according to claim 14 , wherein metal leads lie in a plane and the down set link portion of the support lead is angled away from the plane and the die mounting plate is supported by the support lead spaced apart from the plane.
16. The semiconductor package according to claim 14 , wherein the connection pad portion is spaced from the die mounting plate.
17. The semiconductor package according to claim 14 , wherein the connection pad portion comprises a wire bonding connection pad.
18. The semiconductor package according to claim 14 , wherein the support lead is one of a plurality of support leads, each support lead embedded within the package body and electrically connected to the die mounting plate and extending in an outwardly direction therefrom.
19. The semiconductor package according to claim 14 , wherein the support lead branches to form a first branch portion forming the connection pad portion spaced from the die mounting plate and a second branch portion forming the down set link portion connected to the die mounting plate.
20. The semiconductor package according to claim 19 , wherein the first branch portion and the second branch portion are arranged side by side in the direction of extension of the support lead, thereby overlapping in the direction of extension of the support lead.
21. The semiconductor package according to claim 20 , wherein the support lead branches to form a third branch portion forming a lead portion which extends outwardly towards a frame.
22. The semiconductor package according to claim 14 , wherein the support lead comprises a bridge portion extending laterally to a direction of extension for connecting the down set link portion, which down set link portion is connected to the die mounting plate, to at least two connection pad portions which are spaced from the die mounting plate.
23. The semiconductor package according to claim 14 , wherein the support lead comprises a bridge portion extending laterally to a direction of extension for connecting the down set link portion, which down set link portion is connected to the die mounting plate, to at least one connection pad portion, with each connection pad portion spaced from the die mounting plate, and to at least one lead portion, with each lead portion extends outwardly towards the frame.
24. A leadframe for a semiconductor package, the leadframe comprising: frame means for supporting connection means; die mounting means for supporting a semiconductor device; connection means for electrically connecting to a semiconductor device, the connection means extending inwardly from the frame means and separated from the die mounting means; and a support electrically connected to the die mounting means and extending in a direction outwardly therefrom; wherein the support includes a connection pad for electrical connection to a conductive bonding ground wire, down set means for spacing the die mounting means from the connection means, and a bridge means for coupling the connection pad to the down set means, wherein the connection pad and down set means are oriented along a direction of extension of the support and disposed side-by-side to each other, wherein the bridge means is oriented perpendicular to the direction of extension of the support, wherein the down set means extends beyond the connection pad to connect to the die mounting means.
25. The semiconductor package according to claim 14 , wherein the connection pad portion is directly connected to the semiconductor device through a bonding wire.
26. The leadframe according to claim 1 , wherein the connection pad portion is coupled to a ground potential node.
27. The semiconductor package according to claim 14 , wherein the connection pad portion is coupled to a ground potential node.
28. A semiconductor package comprising: a leadframe comprising: a connection lead supporting frame; a die mounting plate located inside the frame; a plurality of connection leads extending inwardly from the frame and terminating adjacent the die mounting plate but separated therefrom; and at least one support lead electrically connected to the die mounting plate and extending in a direction outwardly therefrom towards the frame; wherein the support lead comprises a connection pad portion, a bridge portion, and a down set link portion, wherein the connection pad portion is coupled to a ground potential node, wherein the down set link portion extends beyond the connection pad portion to connect to the die mounting plate, wherein the connection pad portion is coupled to the down set link portion through the bridge portion, wherein the connection pad portion and down set link portion are oriented along a direction of extension of the support lead and disposed side-by-side to each other, and wherein the bridge portion is oriented perpendicular to the direction of extension of the support lead; and a semiconductor die attached to the leadframe.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 5, 2008
January 25, 2011
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