Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically sealing protective layer is impermeable to gas, liquid, and electromagnetic waves, temperature-resistant, electrically insulating, and process-resistant.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for the production of a package comprising: providing a substrate with one or more components arranged on an upper surface of the substrate; forming a hermetically sealing protective layer on the one or more components and on the upper surface of the substrate, with the hermetically sealing protective layer being gas impermeable, liquid impermeable, impermeable to electromagnetic waves, heat resistant, electrical insulating and process resistant; exposing a contact area to the one or more components by opening a respective window in the hermetically sealing protective layer; and bringing an electrical conducting material into contact with the contact area.
2. The method for the production of a package as claimed in claim 1 , wherein forming the hermetically sealing protective layer comprises forming a plurality of sub-layers stacked one on top of another.
3. The method for the production of a package as claimed in claim 2 , wherein forming of the plurality of sub-layers comprises laminating a film made of an electrically insulating plastic material.
4. The method for the production of a package as claimed in claim 3 , wherein the plastic material is selected from the group consisting of a polyimide, a polyamide, a polyethylene, a polyphenol, a polyetheretherketone and an epoxy resin.
5. The method for the production of a package as claimed in claim 2 , wherein forming the plurality of sub-layers comprises forming a metallic sub-layer.
6. The method for the production of a package as claimed in claim 5 , wherein the metallic sub-layer is formed from a metal selected from the group consisting of aluminium, copper, titanium and nickel.
7. The method for the production of a package as claimed in claim 2 wherein forming the plurality of sub-layers comprises forming an inorganic layer.
8. The method for the production of a package as claimed in claim 7 , wherein the inorganic layer contains silicon oxide.
9. The method for the production of a package as claimed in claim 2 , wherein forming the plurality of sub-layers comprises forming an organic layer from an organic material.
10. The method for the production of a package as claimed in claim 9 , wherein the organic material contains parylene.
11. The method for the production of a package as claimed in claim 2 , wherein forming the plurality of sub-layers comprises forming a layer of an organically modified ceramic.
12. The method for the production of a package as claimed in claim 1 , wherein forming the hermetically sealing protective layer comprises forming a filler layer.
13. The method for the production of a package as claimed in claim 12 , wherein the filler layer contains silicon oxide or carbon.
14. The method for the production of a package as claimed in claim 1 , wherein the substrate comprises: an insulating layer having upper and lower opposing surfaces; a first metallic layer applied to the lower surface of the insulating layer; and a second metallic layer applied to the upper surface of the insulating layer, the second metallic layer being a structured metallic layer.
15. The method for the production of a package as claimed in claim 1 , wherein the hermetically sealing protective layer is formed by a physical separation method.
16. The method for the production of a package as claimed in claim 15 , wherein the physical separation method comprising a sputter process or a vaporization process.
17. The method for the production of a package as claimed in claim 1 , wherein the hermetically sealing protective layer is formed by a spray process.
18. The method for the production of a package as claimed in claim 1 , wherein the hermetically sealing protective layer is formed by a casting process.
19. The method for the production of a package as claimed in claim 1 , wherein the hermetically sealing protective layer is formed by a chemical separation method.
20. The method for the production of a package as claimed in claim 19 , wherein the chemical separation method is a chemical vapour deposition method or a low pressure chemical vapour deposition method.
21. The method as claimed in claim 1 , wherein the window is opened by a photolithographic process.
22. The method as claimed in claim 1 , wherein window is opened by laser ablation.
23. The method as claimed in claim 1 , wherein window is opened by an etching method.
24. The method as claimed in claim 1 , wherein the window is opened by a mechanical method.
25. The method as claimed in claim 1 , wherein the electrically conducting material is brought into contact with the contact area by forming a plurality of individual layers of different electrically conducting materials stacked one on top of another.
26. A package comprising: a substrate having a surface; a component formed on the surface of the substrate; and a hermetically sealing protective layer formed on the component and on the surface of the substrate, the protective layer being gas impermeable, liquid impermeable, impermeable to electromagnetic waves, heat resistant, electrical insulating and process resistant, wherein the component has a contact area exposed through a window in hermetically sealing protective layer, and a contact layer of an electrically conductive material is formed in the window to contact the contact area.
27. The package as claimed in claim 26 , wherein the hermetically sealing protective layer comprises a plurality of sub-layers stacked one on top of another.
28. The package as claimed in claim 27 , wherein at least one of the sub-layers is formed of an electrically insulating plastic.
29. The package as claimed in claim 28 , wherein the electrically insulating plastic is selected from the group consisting of a polyimide, a polyamide, a polyethylene, a polyphenol, a polyetheretherketone and an epoxy resin.
30. The package as claimed in claim 27 , wherein at least one of the sub-layers is a metallic layer.
31. The package as claimed in claim 30 , wherein the metallic layer is formed from a metal selected from the group consisting of aluminium, copper, titanium and nickel.
32. The package as claimed in claim 27 , wherein at least one of the sub-layers is an inorganic layer formed of an inorganic material.
33. The package as claimed in claim 32 , wherein the inorganic material contains silicon oxide.
34. The package as claimed in claim 27 , wherein at least one of the sub-layers is an organic layer formed of an organic material.
35. The package as claimed in claim 34 , wherein the inorganic material contains parylene.
36. The package as claimed in claim 27 , wherein at least one of the sub-layers is an organic modified ceramic.
37. The package as claimed in claim 26 , wherein the hermetically sealing protective layer is formed from a filler material.
38. The package as claimed in claim 37 , wherein the filler material is silicon oxide or carbon.
39. The package as claimed in claim 26 , wherein the substrate comprises: an insulating layer having upper and lower opposing surfaces; a first metallic layer applied to the lower surface of the insulating layer; and a second metallic layer applied to the upper surface of the insulating layer, the second metallic layer being a structured metallic layer.
40. The package as claimed in claim 26 , wherein the contact layer comprises a plurality of individual layers of respective materials having different electrical conductivities stacked one on top of another.
41. A package comprising: an insulating layer having upper and lower opposing surfaces; a first metallic layer applied to the lower surface of the insulating layer; a second metallic layer applied to the upper surface of the insulating layer, the second metallic layer being patterned to have base portions; a plurality of electrical components formed respectively on the base portions of the substrate second metallic layer; and a hermetically sealing protective layer formed on the components, the second metallic layer and the upper surface of the substrate, the hermetically sealing protective layer comprising a plurality of sub-layers stacked one on top of another, the sub-layers comprising: an electrically insulating plastic selected from the group consisting of a polyimide, a polyamide, a polyethylene, a polyphenol, a polyetheretherketone and an epoxy resin; a metallic layer formed from a metal selected from the group consisting of aluminium, copper, titanium and nickel; and an organic layer formed of an organic material containing parylene, wherein the components each have a contact area exposed through a window in hermetically sealing protective layer, and an electrically conductive material is formed in each window to contact the contact areas.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 28, 2006
March 1, 2011
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