Adhesive paste of polymer resin, fugitive liquid and particulate filler with round edges provides improved performance characteristics.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An adhesive paste consisting essentially of: (A) about 2-30 weight percent organic polymer resin; (B) up to about 30 weight percent fugitive liquid; and (C) about 5-98 weight percent inorganic filler; wherein the filler is present in particulate form and at least about 80% of the filler particles are characterized by round edges and substantially free of flat surfaces and at least about 50% of the filler is mono dispersed, and has a particle size of at least about 50 microns and the balance of the filler has a particle size of less than about 10 microns.
2. An adhesive paste of claim 1 further characterized in that the inorganic filler has a tap density of about from 0.5 to 2.5 gm/cc.
3. An adhesive paste of claim 1 wherein the organic polymer resin is selected from thermoset and thermoplastic resins and mixtures thereof.
4. An adhesive paste of claim 1 wherein the organic polymer resin is in liquid or particulate form.
5. An adhesive paste of claim 3 wherein the organic polymer resin consists essentially of at least one thermoplastic resin.
6. An adhesive paste of claim 3 wherein the organic resin consists essentially of at least one thermoset resin.
7. An adhesive paste of claim 5 wherein the organic polymer resin is selected from at least one of thermoplastic polyester, copolyester, polyamide, copolyamide, polyurethane, polybutylene teraphthalate, polyolefin, acrylic, silicone, and liquid crystalline polymers.
8. An adhesive paste of claim 6 wherein the organic resin is selected from at least one of thermoset resins of epoxies, silicones, reactive polyesters, polyurethanes and polyimides.
9. An adhesive paste of claim 1 further comprising up to about 1.0 weight % sintering aid.
10. An adhesive paste of claim 9 wherein the sintering aid consists essentially of at least one metallo-organic compound.
11. An adhesive paste of claim 9 wherein the sintering aid consists essentially of at least one low melting point glass.
12. An adhesive paste of claim 9 wherein the sintering aid consists essentially of at least one low melting point inorganic salt.
13. An adhesive paste of claim 1 wherein the inorganic filler consists essentially of ceramic particles.
14. An adhesive paste of claim 13 wherein ceramic particles are at least one selected from boron nitride, aluminum oxide and zinc oxide.
15. An adhesive paste of claim 1 wherein the particle size of the ceramic filler is less than about 200 microns.
16. An adhesive paste of claim 1 wherein the shape of ceramic filler is selected from at least one of spheres, oblates, spheroids, oblong spheroids, and ellipsoids.
17. An adhesive paste of claim 1 wherein the larger particles of ceramic filler comprise boron nitride.
18. An adhesive paste of claim 1 wherein the inorganic filler comprises at least about 50% by weight, based on the total inorganic filler, of at least one material having a thermal conductivity greater than about 200 W/mK and at least about 10% by weight, based on the total inorganic filler, of at least one material having a thermal conductivity of less than about 40 W/mK.
19. An adhesive paste of claim 1 wherein the small particles of inorganic filler are selected from intersticial filler alumina and zinc oxide.
20. An adhesive paste of claim 1 wherein the fugitive liquid comprises an effective amount of at least one viscosity modifier.
21. An adhesive paste of claim 20 wherein the viscosity modifier comprises about from 0.05 to 5 volume % of the adhesive paste.
22. An adhesive paste of claim 20 wherein the viscosity modifier comprises at least one selected from styrene-butadiene-styrene, styrene-isoprene-styrene, styrene ethylene/butylene-styrene, styrene-ethylene/propylene-styrene, styrene-butadiene, styrene-butadiene-styrene, styrenic block copolymers, and polyisobutylene.
23. A process for assembling an electronic component on a substrate, comprising the steps of: (A) depositing an adhesive paste on a substrate, the paste consisting essentially of (i) about from 2 to 30 weight % of organic polymer resin; (ii) up to about 30 weight % fugitive liquid; and (iii) about from 5 to 98 weight % of inorganic filler; wherein the inorganic filler is present in particulate form and at least about 50% of the inorganic filler particles are characterized by round edges and substantially free of flat surfaces and at least about 50% of the filler is mono dispersed and at least about 50 microns in particle size and the balance are particles having a particle size of less than about 10 microns; (B) placing an electronic component on the substrate in contact with the adhesive paste; (C) heating the resulting assembly to a temperature above which the resin forms an adhesive bond between the two components; and (D) cooling the assembly to ambient temperature.
24. A process for assembling an electronic component on a substrate comprising the steps of: (A) depositing an adhesive according to claim 1 on an electronic component or substrate; (B) partially curing the adhesive on the component or substrate; (C) applying heat and pressure sufficient to bond the component to the substrate; and (D) cooling the assembly to ambient temperature.
25. An article made by the process of claim 23 .
26. An article made by the process of claim 24 .
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 26, 2008
March 15, 2011
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