The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An apparatus for plating a conductive material on a substrate, comprising: a fluid basin configured to retain an electrolyte; a contact ring configured to support the substrate and contact the substrate electrically; and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises: a frame member having a plurality of openings defining a pattern; a plurality of anode elements disposed in the plurality of openings of the frame member and arranged in the pattern defined by the plurality of openings, wherein the plurality of anode elements are isolated from each other; and a printed circuit board for biasing the plurality of anode elements individually or by group, the printed circuit board has a plurality of through holes defining the same pattern as the plurality of opening in the frame member, each through hole has a conductive plate formed therein, and the printed circuit board and the frame member are stacked together.
2. The apparatus of claim 1 , wherein the plurality of anode elements are divided into a plurality of circular sectors arranged in a concentric manner by the printed circuit board, anode elements in each of the plurality of circular sectors are connected in series and biased simultaneously.
3. The apparatus of claim 1 , wherein the plurality of anode elements are divided to a plurality of parallel zones by the printed circuit board, and the anode elements in each of the parallel zones are biased simultaneously.
4. The apparatus of claim 1 , wherein the anode assembly further comprises a foil stacked between the frame member and the printed circuit board and configured for detecting any leakage of the electrolyte from the openings of the frame member, and the foil has a plurality of openings larger than the conductive plates in the through holes of the printed circuit board.
5. An electrochemical plating system, comprising: a fluid basin configured to retain an electrolyte; a substrate support having a contact ring configured to contact a substrate electrically; and an anode assembly comprising: a printed circuit board having a plurality of through holes defining a pattern, wherein each through hole has a conductive plate formed therein; a plurality of anode elements disposed in the plurality of through holes in the printed circuit board, wherein the printed circuit board is configured to connect the plurality of anode elements with a power supply; and a frame member having a plurality of openings defining the pattern, wherein the frame member is stacked over the printed circuit board, and the plurality of anode elements are sealingly disposed in the plurality of openings.
6. A method for plating a conductive material on a substrate, comprising: providing an anode assembly disposed in an electrolyte, wherein the anode assembly comprises: a frame member having a plurality of openings defining a pattern; and a plurality of anode elements disposed in the plurality of opening of the frame member and arranged in the pattern defined by the plurality of openings, wherein the plurality of anode elements are isolated from each other; contacting the substrate using a contact ring; immersing the substrate in the electrolyte; and applying a plating bias between the contact ring and the anode assembly, wherein applying the plating bias comprises providing electric power to the plurality of anode elements via conductive plates formed in a plurality of through holes of a printed circuit board, and the plurality of through holes of the printed circuit board are aligned with the plurality of openings of the frame member.
7. The method of claim 6 , further comprising: sensing potential or current in the electrolyte; and adjusting the electric power on the plurality of anode elements.
8. The method of claim 6 , wherein applying plating bias to the plurality of anode elements further comprises: dividing the plurality of anode elements into a plurality of circular sectors arranged in a concentric manner by the printed circuit board; and powering each of the plurality of circular sectors independently.
9. The method of claim 8 , wherein dividing the plurality of anode elements into a plurality of circular sectors comprises connecting the anode elements in each of the plurality of circular sectors in series.
10. The method of claim 6 , wherein applying plating bias to the plurality of anode elements further comprises: dividing the plurality of anode elements into a plurality of parallel zones via the printed circuit board; and powering each of the plurality of parallel zones independently.
11. The method of claim 10 , wherein immersing the substrate in the electrolyte comprising applying immersing bias to the respective parallel zones corresponding to immersed portion of the substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 16, 2006
May 3, 2011
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