A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A transferring device that transfers a plate-like member among a plurality of tables on which said plate-like member is placed, comprising: a supporting means provided with a supporting face configured to support said plate-like member; and a robot configured to move the supporting means, wherein said supporting face includes an adhesive sheet in which an adhesive layer is laminated on a sheet base material, and wherein said plate-like member is transferred among said plurality of tables by a sticking and peeling operation of said adhesive sheet to and from said plate-like member.
2. The transferring device according to claim 1 , wherein said supporting means includes a feed-out section for supporting and feeding out the adhesive sheet and a winding section for winding the adhesive sheet fed out from the feed-out section, and wherein said supporting face is a portion of the adhesive sheet between the feed-out section and the winding section.
3. The transferring device according to claim 1 , wherein said supporting face is configured to stick to the whole surface of the plate-like member.
4. The transferring device according to claim 1 , wherein said supporting means sticks said adhesive sheet to the plate-like member and/or peels off said adhesive sheet from the plate-like member by moving from a first edge portion toward a second edge portion, in a side view of said plate-like member.
5. The transferring device according to claim 1 , wherein said adhesive layer is an energy ray curable adhesive layer, and wherein said supporting means further includes an energy ray irradiation means.
6. The transferring device according to claim 1 , wherein said supporting means includes a displacement means to partially displace a position of said adhesive sheet.
7. The transferring device according to claim 6 , wherein said displacement means displaces said adhesive sheet when said adhesive sheet is stuck to the plate-like member so that sticking operation is executed from a central portion toward both edge portions, in a side view of said plate-like member, synchronously with said moving means.
8. The transferring device according to claim 6 , wherein said displacement means displaces said adhesive sheet when said adhesive sheet stuck to said plate-like member is peeled off from the plate-like member so that peeling operation is executed from both edge portions toward a central portion, in a side view of said plate-like member, synchronously with said moving means.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 29, 2008
June 28, 2011
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