Methods and systems for processing signals via power splitters embedded in an integrated circuit package may include generating via a power splitter, one or more RF signals proportional to one or more received RF signals. The power splitter may be integrated in a multi-layer package. The generated RF signals may be processed via an integrated circuit, which may be electrically coupled to the multi-layer package. The power splitters may include quarter wavelength transmission lines. The transmission lines may include a microstrip structure or a coplanar structure. The power splitters may be bonded to one or more capacitors in the integrated circuit. The capacitors may include CMOS devices in the integrated circuit. The power splitters may include lumped devices which may include surface mount devices coupled to the multi-layer package or devices within the integrated circuit, which may be flip-chip bonded to the multi-layer package.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for wireless communication, the method comprising: generating, utilizing a power splitter, one or more RF signals whose power is proportional to one or more received RF signals, wherein said power splitter is integrated in a multi-layer package; and processing said one or more generated RF signals utilizing one or more circuits within an integrated circuit, wherein said integrated circuit is bonded to said multi-layer package.
2. The method according to claim 1 , wherein said power splitter comprises quarter wavelength transmission lines or any integer multiple of quarter wavelength.
3. The method according to claim 2 , wherein said transmission lines comprise a microstrip structure.
4. The method according to claim 2 , wherein said transmission lines comprise a coplanar structure.
5. The method according to claim 1 , wherein said power splitter is electrically coupled to one or more capacitors in said integrated circuit.
6. The method according to claim 5 , wherein said one or more capacitors comprise CMOS devices in said integrated circuit.
7. The method according to claim 1 , wherein said power splitters comprise lumped devices.
8. The method according to claim 7 , wherein said lumped devices comprise surface mount devices coupled to said multi-layer package.
9. The method according to claim 7 , wherein said lumped devices comprise devices integrated in said integrated circuit.
10. The method according to claim 1 , wherein said integrated circuit is flip-chip bonded to said multi-layer package.
11. A system for wireless communication, the system comprising: a multilayer package bonded to an integrated circuit, wherein said multi-layer package comprises a power splitter that is operable to generate one or more RF signals whose power is proportional to a received RF signal; and one or more circuits within said integrated circuit that is operable to process said one or more generated RF signals.
12. The system according to claim 11 , wherein said power splitter comprises quarter wavelength transmission lines or any integer multiple of quarter wavelength.
13. The system according to claim 12 , wherein said transmission lines comprise a microstrip structure.
14. The system according to claim 12 , wherein said transmission lines comprise a coplanar structure.
15. The system according to claim 11 , wherein said power splitter is electrically coupled to one or more capacitors in said integrated circuit.
16. The system according to claim 15 , wherein said one or more capacitors comprise CMOS devices in said integrated circuit.
17. The system according to claim 11 , wherein said power splitters comprise lumped devices.
18. The system according to claim 17 , wherein said lumped devices comprise surface mount devices coupled to said multi-layer package.
19. The system according to claim 17 , wherein said lumped devices comprise devices integrated in said integrated circuit.
20. The system according to claim 11 , wherein said integrated circuit is flip-chip bonded to said multi-layer package.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 28, 2008
July 19, 2011
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