Method and structure for a microwave antenna module is provided. The method includes, creating a laminate structure by laminating a plurality of conductive layers and dielectric layers; creating a plurality of layers within the laminate structure to interconnect the plurality of conductive layers and dielectric layers; laminating a base plate to a bottom of the laminate structure; wherein the baseplate operates as a heat sink; and laminating a seal ring to a top periphery of the laminate structure.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a microwave antenna module, comprising: creating a laminate structure with a top side and a bottom side, by laminating a plurality of conductive layers and dielectric layers between the top side and the bottom side, wherein creating the laminate structure further comprises: forming a first stripline having a first metal layer, a third metal layer, and a second metal layer suspended between the first metal layer and the third metal layer by a first dielectric and adhesive layer, wherein the first metal layer and the third metal layer are ground planes connected by a first via to a plating, to a fourth metal layer and to a sixth metal layer, and wherein the second metal layer is a first radio frequency signal layer; forming a second stripline having the fourth metal layer, the sixth metal layer, and a fifth metal layer suspended between the fourth metal layer and the sixth metal layer by a second dielectric and adhesive layer, wherein the fourth metal layer and the sixth metal layer are ground planes connected by the first via to the plating and the fifth metal layer is a second radio frequency signal layer; forming a seventh metal layer and an eighth metal layer, with a third dielectric layer interposed between the seventh metal layer and the eighth metal layer, wherein the seventh metal layer is a first data layer, and the eighth metal layer is a second data layer, wherein the first metal layer is the top side of the laminate structure and the fourth metal layer is the bottom side of the laminate structure; connecting the first metal layer to the seventh metal layer by a second via; connecting the first metal layer to the eighth metal layer by a third via; connecting the second metal layer to the first metal layer by a first blind via; connecting the fifth metal layer to the first metal layer by a second blind via; affixing the seventh metal layer to the third metal layer by a first prepreg layer; and affixing the eighth metal layer to the sixth metal layer by a second prepreg layer; creating a cutout in the laminate structure, the cutout having a plurality of walls extending from the top side to the bottom side of the laminate structure; plating the plurality of walls of the cutout extending from the top side to the bottom side and grounding the plated walls of the cutout; laminating a base plate to the bottom side of the laminate structure, wherein the baseplate operates as a heat sink; disposing a standoff in the cutout and attaching the standoff to the baseplate; attaching a component to the standoff so as to substantially dispose the component in the cutout and elevate the component to the top side of the laminate structure; and laminating a seal ring to a periphery of the top side of the laminate structure.
2. The method of claim 1 , further including coupling one or more of the conductive layers of the laminate structure to the plated wall of the cutout.
3. The method of claim 1 , wherein the standoff is attached by using an adhesive.
4. The method of claim 1 , wherein the component is an application specific integrated circuit.
5. The method of claim 1 , wherein the component is a microwave integrated circuit.
6. The method of claim 1 , wherein the seal ring is attached to the laminate structure using an adhesive.
7. The method of claim 1 , further including wire bonding the component to the conductive layer of the laminate structure.
8. The method of claim 1 , further including disposing a lid over the seal ring to seal the antenna module.
9. The method of claim 1 further comprising: wherein the first data layer further comprises a first direct current layer and a first clock data layer; and wherein the second data layer further comprises a second direct current layer and a second clock data layer.
10. A structure for a microwave antenna module comprising: a laminate structure with a top side and a bottom side, fabricated by laminating a plurality of conductive layers and dielectric layers between the top side and the bottom side wherein the laminate structure further comprises: a first stripline having a first metal layer, a third metal layer, and a second metal layer suspended between the first metal layer and the third metal layer by a first dielectric and adhesive layer, wherein the first metal layer and the third metal layer are ground planes connected by a first via to a plating, to a fourth metal layer and to a sixth metal layer, and wherein the second metal layer is a first radio frequency signal layer; a second stripline having the fourth metal layer, the sixth metal layer, and a fifth metal layer suspended between the fourth metal layer and the sixth metal layer by a second dielectric and adhesive layer, wherein the fourth metal layer and the sixth metal layer are ground planes connected by the first via to the plating and the fifth metal layer is a second radio frequency signal layer; a seventh metal layer and an eighth metal layer; a third dielectric layer interposed between the seventh metal layer and the eighth metal layer, wherein the seventh metal layer is a first data layer, and the eighth metal layer is a second data layer, wherein the first metal layer is a top side of the microwave antennae module and the fourth metal layer is a bottom side of the microwave antennae module; a seventh metal layer and an eighth metal layer, with a third dielectric layer interposed between the seventh metal layer and the eighth metal layer, wherein the seventh metal layer is a first data layer, and the eighth metal layer is a second data layer; a first prepreg layer affixing the seventh metal layer to the third metal layer; a second prepreg layer affixing the eighth metal layer to the sixth metal layer; a second via connecting the first metal layer to the seventh metal layer; a third via connecting the first metal layer to the eighth metal layer; a first blind via connecting the second metal layer to the first metal layer; a second blind via connecting the fifth metal layer to the first metal layer; a base plate laminated to the bottom side of the laminate structure; a seal ring attached to a periphery of the top side of laminate structure; a conductive standoff disposed inside the cutout and attached to the base plate; a component attached to the conductive standoff and substantially disposed in the cutout and elevated to the top side of the laminate structure; and wherein the base plate operates as a heat sink; wherein the standoff provides heat conduction between the component and the base plate; wherein the second metal layer is a first radio frequency signal layer; and wherein the first metal layer is the top side of the laminate structure and the fourth metal layer is the bottom side of the laminate structure.
11. The structure of claim 10 , wherein the standoff is attached by using an adhesive.
12. The structure of claim 10 , wherein the component is an application specific integrated circuit.
13. The structure of claim 10 , wherein the component is a microwave integrated circuit.
14. The structure of claim 10 , wherein the seal ring is attached to the laminate structure using an adhesive.
15. The structure of claim 10 , wherein a wire bond couples the component to the conductive layer of the laminate structure.
16. The structure of claim 10 , wherein a lid is disposed over the seal ring to seal the antenna module.
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December 6, 2006
July 19, 2011
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