A semiconductor package is provided with a package body including a base part and a semiconductor device housing part housing a semiconductor device. An electric terminal electrically connected to the device is provided in the housing part and is exposed to an outer surface. A high heat transfer element is arranged from a heat generating part corresponding position corresponding to a heat generating part of the device to a position outside the corresponding position in the base part. The base part is configured by contacting a plurality of thin sheets mutually closely with each other and by bonding integrally with each other. The high heat transfer element includes particles configured by a material having a thermal conductivity higher than that of the base part and dispersed in the base part. The particles are dispersed between two mutually adjacent thin sheets among the thin sheets.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor package comprising: a package body including a base part having a first surface and a second surface on an opposite side of the first surface, and a semiconductor device housing part provided on the first surface and in which a semiconductor device having a heat generating part is housed, the base part further having a heat generating part corresponding position corresponding to the heat generating part of the semiconductor device and a position outside the heat generating part corresponding position; an electric terminal provided in the semiconductor device housing part, electrically connected to the semiconductor device, and exposed to an outer surface of the semiconductor device housing part; and a high heat transfer element having a thermal conductivity higher than that of the base part, arranged from the heat generating part corresponding position to the outside position in the base part, and transferring heat generated by the heat generating part of the semiconductor device from the heat generating part corresponding position to the outside position in the base part, the base part being configured by contacting a plurality of thin sheets mutually closely with each other and by bonding integrally with each other, the high heat transfer element including particles configured by a material having a thermal conductivity higher than that of the base part, and dispersed in the base part, and the particles of the high heat transfer element being dispersed between two mutually adjacent thin sheets among the plurality of thin sheets of the base part.
2. The semiconductor package according to claim 1 , wherein a first thin sheet including the first surface and a second thin sheet including the second surface among the plurality of thin sheets of the base part prevent the particles of the high heat transfer element from exposing on the first surface and the second surface.
3. The semiconductor package according to claim 1 , wherein the plurality of thin sheets of the base part includes at least one thin sheet having a thermal expansion coefficient equal to or less than that of a substrate of the semiconductor device.
4. The semiconductor package according to claim 1 , wherein a peripheral circuit mounting substrate mounting a peripheral circuit for the semiconductor device is further housed in the semiconductor device housing part, and the plurality of thin sheets of the base part includes at least one thin sheet having a thermal expansion coefficient equal to or less than that of a substrate of the semiconductor device or the peripheral circuit mounting substrate.
5. The semiconductor package according to claim 1 , wherein the particles of the high heat transfer element includes particles of diamond.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 26, 2009
November 1, 2011
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