A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A wired circuit board comprising: a metal supporting board; a metal foil formed on the metal supporting board; an insulating base layer formed on the metal supporting board to cover the metal foil; a conductive pattern formed on the insulating base layer and having a terminal portion; a main body portion in which the terminal portion is provided; a removal portion which can be removed from the main body portion; and a perforation provided between the main body portion and the removal portion, wherein an opening is formed in the insulating base layer to expose the metal foil, and the opening is formed in the removal portion.
2. The wired circuit board according to claim 1 , further comprising: an insulating cover layer formed on the insulating base layer to cover the conductive pattern and expose the terminal portion and the metal foil exposed from the opening; and an electrolytic plating layer formed on a surface of the terminal portion.
3. The wired circuit board according to claim 1 , wherein the removal portion is removable from the main body portion at the perforation as a boundary line.
4. The wired circuit board according to claim 1 , wherein the perforation is formed as a series of perforated holes along which the metal supporting board, the insulating base layer, and the metal foil are intermittently removed.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 12, 2007
November 22, 2011
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