A method of manufacture of an integrated circuit packaging system includes: forming a base lead having an outer protrusion and an inner protrusion with a recess in between; forming a stack lead having an elongated portion; mounting a base integrated circuit over the inner protrusion or under the elongated portion; mounting the stack lead over the base lead and the base integrated circuit; connecting a stack integrated circuit and the stack lead with the stack integrated circuit over the base integrated circuit; and encapsulating at least a portion of both the base integrated circuit and the stack integrated circuit with the base lead and the stack lead exposed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An integrated circuit packaging system comprising: a base lead having an outer protrusion and an inner protrusion with a recess in between; a flip-chip, having a base non-active side, coupled to and facing the inner protrusion; a stack lead, having an overhang portion and an elongated portion, over the outer protrusion and the base non-active side with the flip-chip over the inner protrusion or under the elongated portion; a stack integrated circuit connected to the elongated portion with the stack integrated circuit over the flip-chip; and an encapsulation covering at least a portion of both the flip-chip and the stack integrated circuit with the base lead and the overhang portion exposed.
2. The system as claimed in claim 1 wherein the stack lead over the base lead and the flip-chip includes: the stack lead connected to the outer protrusion; and the elongated portion over a base non-active side of the flip-chip.
3. The system as claimed in claim 1 wherein the stack integrated circuit connected to the stack lead includes the stack integrated circuit connected to the elongated portion.
4. The system as claimed in claim 1 wherein the flip-chip over the inner protrusion includes the flip-chip connected to the inner protrusion with the flip-chip facing the inner protrusion.
5. The system as claimed in claim 1 wherein the stack integrated circuit connected to the stack lead with the stack integrated circuit over the flip-chip includes the stack integrated circuit connected to the flip-chip.
6. The system as claimed in claim 1 wherein the encapsulation includes: the encapsulation having a recess exposing the flip-chip, the stack integrated circuit, or a combination thereof; and further comprising: an external component in the recess.
7. The system as claimed in claim 1 further comprising a further base lead over the stack lead, the further base lead identical to the base lead.
8. The system as claimed in claim 1 further comprising a lead interconnect between the base lead and the stack lead.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 29, 2009
December 20, 2011
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