The electronic apparatus includes a base sheet; a conductive pattern formed on the base sheet; a circuit chip mounted on the base sheet and connected to the conductive pattern; and plural protrusions arranged on at least one of a frontside and a backside of the base sheet to overlap at least a portion of the conductive pattern. The plural protrusions protrude in a direction away from the base sheet.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An electronic apparatus comprising: a base sheet; a conductive pattern formed on the base sheet; a circuit chip mounted on the base sheet and connected to the conductive pattern; and a plurality of protrusions arranged on at least one of a frontside and a backside of the base sheet to overlap at least a portion of the conductive pattern, the plurality of protrusions protruding in a direction away from the base sheet, wherein the conductive pattern constitutes an antenna for wireless communication, and the circuit chip performs wireless communication through the antenna.
2. The electronic apparatus according to claim 1 , wherein the plurality of protrusions are higher in rigidity than the base sheet.
3. The electronic apparatus according to claim 1 , wherein the plurality of protrusions are a plurality of cone-like articles each of which has a bottom surface shaped like a polygon, and which are arranged such that the bottom surfaces are connected to one another.
4. The electronic apparatus according to claim 1 , further comprising: a protection body which is broader than the circuit chip and narrower than the conductive pattern, and protects the circuit chip by being disposed on at least one of an upperside of the circuit chip and an underside of the circuit chip where the base sheet is interposed between the circuit chip and the protection body, wherein the plurality of protrusions are arranged at least on an area of surroundings of the protection body, the area being provided with the conductive pattern.
5. The electronic apparatus according to claim 1 , wherein the plurality of protrusions are arranged on both the frontside and backside of the base sheet.
6. The electronic apparatus according to claim 1 , further comprising a coat article in which the base sheet, the conductive pattern, the circuit chip, and the protrusions are contained.
7. A method of manufacturing an electronic apparatus comprising the steps of: mounting a circuit chip on a base sheet on which a conductive pattern is arranged, and connecting the circuit chip to the conductive pattern; and arranging and forming a plurality of protrusions by arranging, in a direction away from the base sheet, the plurality of protrusions on at least one of a frontside and a backside of the base sheet on which the circuit chip is mounted, such that the arranged protrusions overlap at least a portion of the arranged conductive pattern, wherein the conductive pattern constitutes an antenna for wireless communication, and the circuit chip performs wireless communication through the antenna.
8. The method according to claim 7 , wherein the step of arranging and forming the plurality of protrusions is a step in which a mold having a shape corresponding to a shape of the protrusions is placed on at least one of the frontside and the backside of the base sheet on which the circuit chip is mounted, a liquid material for the protrusions is poured between the base sheet and the mold, and the liquid material is cured, thereby forming the plurality of protrusions.
9. The method according to claim 7 , wherein the step of arranging and forming the plurality of protrusions is a step in which a plate formed of a same material as the protrusions is placed on at least one of the frontside and the backside of the base sheet on which the circuit chip is mounted, and the plate is processed into the plurality of protrusions.
10. The method according to claim 7 , wherein the step of arranging and forming the plurality of protrusions is a step of forming a plurality of protrusions which are higher in rigidity than the base sheet.
11. The method according to claim 7 , wherein the step of arranging and forming the plurality of protrusions is a step of forming a plurality of cone-like articles each of which has a bottom surface shaped like a polygon, and which are arranged such that the bottom surfaces are connected to one another.
12. The method according to claim 7 , further comprising the step of forming a protection body which is broader than the circuit chip and narrower than the conductive pattern, and protects the circuit chip by being disposed on at least one of an upperside of the circuit chip and an underside of the circuit chip where the base sheet is interposed between the circuit chip and the protection body, wherein the step of arranging and forming the plurality of protrusions is a step of arranging the plurality of protrusions at least on an area of surroundings of the protection body, the area being provided with the conductive pattern.
13. The method according to claim 7 , wherein the step of arranging and forming the plurality of protrusions is a step of arranging the plurality of protrusions on both the frontside and backside of the base sheet.
14. The method according to claim 7 , further comprising the step of forming a coat article which contains the base sheet, the conductive pattern, the circuit chip, and the protrusions.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
August 14, 2008
December 20, 2011
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.