A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A die package comprising: a premolded substrate comprising a leadframe structure, a first device attached to the leadframe structure, and a first molding material covering at least part of the leadframe structure and the first device; a second device attached to the premolded substrate; a second molding material covering the second device; and a third device, wherein the third device is mounted on the premolded substrate; and wherein the second device and the third device comprise optoelectronic devices and wherein the first device comprises a control device.
2. The die package of claim 1 wherein the leadframe structure comprises a die attach pad, wherein the first device is mounted on a first surface of the die attach pad and wherein the second device is mounted on a second surface of the die attach pad.
3. The die package of claim 1 wherein the die package is an optocoupler package.
4. The die package of claim 1 , wherein the second molding material further covers the third device.
5. A die package comprising: a premolded substrate comprising a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device; a second device attached to the premolded substrate; and a third device mounted on the premolded substrate; and wherein the second device and the third device comprise optoelectronic devices and wherein the first device comprises a control device.
6. The die package of claim 5 wherein the leadframe structure comprises a die attach pad, wherein the first device is mounted on a first surface of the die attach pad and wherein the second device is mounted on a second surface of the die attach pad.
7. The die package of claim 5 wherein the die package is an optocoupler package.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 9, 2008
January 31, 2012
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