In one embodiment of the present invention, an IC chip mounting package includes a film base member and an IC chip connected via an interposer. Connecting terminals on the film base member side of the interposer are provided so as to have a pitch larger than that of connecting terminals of the IC. A device hole is opened to the film base member, and the IC chip is provided in the device hole. A distance between an inner lead leading end and a periphery of the device hole is set as not less than 10 μm.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An IC chip mounting package comprising: an IC chip having input/output terminals; and a package base member for mounting the IC chip, the package base member having first connecting terminals, the IC chip and the package base member being connected via an interposer which includes (i) second connecting terminals, on a side of the package base member, which are arranged so as to be connected to the first connecting terminals, respectively, (ii) third connecting terminals, on a side of the IC chip, which are arranged so as to be connected to the input/output terminals, respectively, and (iii) respective wires for connecting the second connecting terminals and the third connecting terminals, the IC chip being provided inside a device hole of the package base member, leading ends of the first connecting terminals being provided so as to be away from a periphery of the device hole by not less than 10 μm, and a periphery of the IC chip is provided so as to be away from a periphery of the interposer by not less than 0.20 mm but not more than 0.46 mm.
2. The IC chip mounting package as set forth in claim 1 , wherein all sides of the periphery of the IC chip are provided so as to be away from respective sides of the periphery of the interposer by a same distance.
3. The IC chip mounting package as set forth in claim 1 , wherein the periphery of the IC chip is provided so as to be away from the periphery of the interposer and so as to have a longer distance between respective long sides of the periphery of the IC chip and respective long sides of the periphery of the interposer than that between respective short sides of the periphery of the IC chip and respective short sides of the periphery of the interposer.
4. The IC chip mounting package as set forth in claim 1 , wherein the periphery of the IC chip is provided so as to be away from the periphery of the interposer and so as to have a longer distance between respective short sides of the periphery of the IC chip and respective short sides of the periphery of the interposer than that between respective long sides of the periphery of the IC chip and respective long sides of the periphery of the interposer.
5. The IC chip mounting package as set forth in claim 1 , wherein a periphery of the IC chip is provided so as to be away from the periphery of the device hole by not less than 30 μm but not more than 150 μm.
6. The IC chip mounting package as set forth in claim 5 , wherein all sides of the periphery of the IC chip are provided so as to be away from respective sides of the periphery of the device hole by a same distance.
7. The IC chip mounting package as set forth in claim 1 , wherein the device hole has rounded corner sections.
8. The IC chip mounting package as set forth in claim 7 , wherein the rounded corner sections of the device hole have a radius of not more than 0.1 mm.
9. An IC chip mounting package comprising: an IC chip having input/output terminals; and a package base member for mounting the IC chip, the package base member having first connecting terminals, the IC chip and the package base member being connected via an interposer which includes (i) second connecting terminals, on a side of the package base member, which are arranged so as to be connected to the first connecting terminals, respectively, (ii) third connecting terminals, on a side of the IC chip, which are arranged so as to be connected to the input/output terminals, respectively, and (iii) respective wires for connecting the second connecting terminals and the third connecting terminals, the IC chip being provided inside a device hole of the package base member, leading ends of the first connection terminals being provided so as to be away from a periphery of the device hole by not more than 150 μm, and a periphery of the IC chip is provided so as to be away from a periphery of the interposer by not less than 0.20 mm but not more than 0.46 mm.
10. The IC chip mounting package as set forth in claim 9 , wherein all sides of the periphery of the IC chip are provided so as to be away from respective sides of the periphery of the interposer by a same distance.
11. The IC chip mounting package as set forth in claim 9 , wherein the periphery of the IC chip is provided so as to be away from the periphery of the interposer and so as to have a longer distance between respective long sides of the periphery of the IC chip and respective long sides of the periphery of the interposer than that between respective short sides of the periphery of the IC chip and respective short sides of the periphery of the interposer.
12. The IC chip mounting package as set forth in claim 9 , wherein the periphery of the IC chip is provided so as to be away from the periphery of the interposer and so as to have a longer distance between respective short sides of the periphery of the IC chip and respective short sides of the periphery of the interposer than that between respective long sides of the periphery of the IC chip and respective long sides of the periphery of the interposer.
13. The IC chip mounting package as set forth in claim 9 , wherein a periphery of the IC chip is provided so as to be away from the periphery of the device hole by not less than 30 μm but not more than 150 μm.
14. The IC chip mounting package as set forth in claim 13 , wherein all sides of the periphery of the IC chip are provided so as to be away from respective sides of the periphery of the device hole by a same distance.
15. The IC chip mounting package as set forth in claim 9 , wherein the device hole has rounded corner sections.
16. The IC chip mounting package as set forth in claim 15 , wherein the rounded corner sections of the device hole have a radius of not more than 0.1 mm.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 30, 2007
March 6, 2012
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