Sensor module

1. A sensor module, comprising: a cap whose perimeter defines a rim; a first semiconductor chip attached to the cap; wherein the first semiconductor chip comprises first connection elements, wherein the rim and the first connection elements define a common plane, and wherein the first semiconductor chip is a microphone chip and an opening is formed in the cap through which sound waves may enter in the direction of the microphone chip, the microphone chip comprising a front surface and a back surface and the first connection elements are located on the front surface and the microphone chip is attached with the back surface to the cap, and wherein a recess is formed in the back surface of the microphone chip and the recess is in direct communication with the opening of the cap.

2. The sensor module of claim 1 , further comprising: a second semiconductor chip comprising second connection elements and attached to the cap.

3. The sensor module of claim 2 , wherein the first connection elements and the second connection elements are electrically connected to each other via a circuit board.

4. The sensor module of claim 1 , wherein the cap is made of an electrically conductive material, or the cap comprises a surface being covered with an electrically conductive material.

5. The sensor module of claim 4 , wherein the cap comprises a surface being essentially completely covered with an electrically conductive material.

6. A sensor module, comprising: a cap whose perimeter defines a rim; a first semiconductor chip comprising first connection elements and attached to the cap; and a second semiconductor chip comprising second connection elements and attached to the cap, wherein the first semiconductor chip is a microphone chip and an opening is formed in the cap through which sound waves may enter in the direction of the microphone chip, the microphone chip comprising a front surface and a back surface and the first connection elements are located on the front surface and the microphone chip is attached with the back surface to the cap, and wherein a recess is formed in the back surface of the microphone chip and the recess is in direct communication with the opening of the cap.

7. The sensor module of claim 6 , wherein the rim and at least one of the first and second connection elements define a common plane.

8. The sensor module of claim 6 , wherein the cap is made of an electrically conductive material or the cap comprises a surface being covered with an electrically conductive material.

9. The sensor module of claim 8 , wherein the cap comprises a surface being essentially completely covered with an electrically conductive material.

10. The sensor module of claim 6 , wherein the second semiconductor chip defines a front side and a backside, wherein the backside of the second semiconductor chip is attached to the cap, and wherein the connection elements of the second semiconductor chip are attached to the front side of the second semiconductor chip.

11. A sensor module, comprising: a cap made of an electrically conductive material; or a cap having a surface being covered with an electrically conductive material; and a first semiconductor chip attached to the cap, wherein the first semiconductor chip is a microphone chip and an opening is formed in the cap through which sound waves may enter in the direction of the microphone chip, the microphone chip comprising a front surface and a back surface and first connection elements are located on the front surface and the microphone chip is attached with the back surface to the cap, and wherein a recess is formed in the back surface of the microphone chip and the recess is in direct communication with the opening of the cap.

12. The sensor module of claim 11 , wherein the perimeter of the cap defines a rim, and the rim and the first connection elements define a common plane.

13. The sensor module of claim 11 , further comprising: a second semiconductor chip comprising second connection elements and attached to the cap.

14. The sensor module of claim 13 , wherein the first connection elements and the second connection elements are electrically connected to each other via a circuit board.

15. The sensor module of claim 13 , wherein the second semiconductor chip defines a front side and a backside, wherein the backside of the second semiconductor chip is attached to the cap, and wherein the connection elements of the second semiconductor chip are attached to the front side of the second semiconductor chip.

16. A sensor module, comprising: a cap whose perimeter defines a rim; a first semiconductor chip attached to the cap; wherein the first semiconductor chip comprises first connection elements, wherein the rim and the first connection elements define a common plane, wherein the first semiconductor chip is a microphone chip and an opening is formed in the cap through which sound waves may enter in the direction of the microphone chip, the microphone chip comprising a front surface and a back surface and the first connection elements are located on the front surface and the microphone chip is attached with the back surface to the cap, and wherein the microphone chip comprises a membrane, the membrane being located at the front surface of the microphone chip.

17. The sensor module of claim 16 , further comprising: a second semiconductor chip comprising second connection elements and attached to the cap.

18. The sensor module of claim 7 , wherein the first connection elements and the second connection elements are electrically connected to each other via a circuit board.

19. The sensor module of claim 6 , wherein the cap is made of an electrically conductive material, or the cap comprises a surface being covered with an electrically conductive material.

20. The sensor module of claim 9 , wherein the cap comprises a surface being essentially completely covered with an electrically conductive material.

21. A sensor module, comprising: a cap whose perimeter defines a rim; a first semiconductor chip comprising first connection elements and attached to the cap; and a second semiconductor chip comprising second connection elements and attached to the cap, wherein the first semiconductor chip is a microphone chip and an opening is formed in the cap through which sound waves may enter in the direction of the microphone chip, the microphone chip comprising a front surface and a back surface and the first connection elements are located on the front surface and the microphone chip is attached with the back surface to the cap, and wherein the microphone chip comprises a membrane, the membrane being located at the front surface of the microphone chip.

22. The sensor module of claim 21 , wherein the rim and at least one of the first and second connection elements define a common plane.

23. The sensor module of claim 21 , wherein the cap is made of an electrically conductive material or the cap comprises a surface being covered with an electrically conductive material.

24. The sensor module of claim 23 , wherein the cap comprises a surface being essentially completely covered with an electrically conductive material.

25. A sensor module, comprising: a cap made of an electrically conductive material; or a cap having a surface being covered with an electrically conductive material; and a first semiconductor chip attached to the cap, wherein the first semiconductor chip is a microphone chip and an opening is formed in the cap through which sound waves may enter in the direction of the microphone chip, the microphone chip comprising a front surface and a back surface and first connection elements are located on the front surface and the microphone chip is attached with the back surface to the cap, and wherein the microphone chip comprises a membrane, the membrane being located at the front surface of the microphone chip.